The Nordson DAGE 4000Plus is the most advanced bond tester on the market. This next generation system represents the industry standard in bond testing and offers unsurpassed accuracy and repeatability of data, providing complete confidence in results.The 4000Plus multi-purpose bondtester performs shear tests up to 200kg, pull tests up to 100kg and push tests up to 50kg, covering all test applications including new hot bump pull and fatigue applications:
Dage 4000 Plus Multi-function bond tester overview
A range of XY stages, with a 160mm XY stage as standard, meets a wide range of requirements. The image capture system for advanced analysis is quick to set-up and in close proximity to the test head aiding faster testing.
The standard 4000Plus mainframe has a vertical working envelope of 120mm to meet the majority of application requirements however the Nordson DAGE 4000Plus LE with an extended working envelope of 200mm is available for testing oversize parts.
Ultimate Step Back Accuracy
The 4000Plus features the latest in bond testing technology, for example the anti-backlash system which aids setting and control of step back. Shear height can be set and maintained to single micron accuracy.
Nordson DAGE recognizes that data correlation is fundamental for cross referencing test results between old and new platforms. Existing users of Nordson DAGE bond testers (4000 and 5000) can confidently compare data between old and new machines. Further, we know that many users collect data on the same product from multiple machines, either on the same site or even different sites, and need to be sure that the data will correlate with ultimate integrity given identical configurations and test parameters.
The 4000Plus utilizes Paragon™ software which boasts a highly configurable and intuitive interface as well as a wide variety of advanced functionality such as automatic GR&R calculation, built-in diagnostics, a unique database search engine wizard and superior reporting.
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Tel: +44 (0)1264 334505
Semiconductor Defect Analysis & Characterisation, Wire Bond Testing, Validation Of Process & Machine Setup, In Process Quality Control, Wire Bond Strength Analysis, Materials Testing, Die Shear & Bond Shear Strength Checks including: Ball Shear/Solder Ball Shear, Cold Bump Pull, Die Shear, First Bond Ball Pull/Stud Bump Pull, High Force Pull, High Strain Rate, Ribbon Peel, Ribbon Pull, Stud Pull, Tweezer Pull, Vector Pull, Wedge Shear, Wire Pull & Zone Shear.
Semiconductor, Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Fibre Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Medical Devices
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark