Nordson DAGE has a strong portfolio of products for destructive and non-destructive mechanical testing and inspection of electronic components including wire pull, bond shear, die shear, tweezer & stud pull, fatigue testing etc.
With its self-contained R&D facilities, Nordson DAGE has developed world-leading products for testing wire bonds on semiconductor packages such as MCM's, Hybrids, BGAs, Chip Scale Packages (CSP) and other electronic components. Their commitment to continuous development has ensured that products are brought swiftly to market to support customers in emerging and advanced technology sectors. A philosophy that has most recently led to the development & introduction of the 4000 Optima & Plus platforms.
Product range overview
The Nordson DAGE 4000 Optima is optimized for accurate and reliable high speed bond testing (wire pull, shear test, tweezer pull etc.) in the production & engineering environments. A combination of patented technology, superior ergonomics and intelligent intuitive software make the 4000 Optima the number one production & engineering bond tester; providing repeatable and reproducible results.
The Nordson DAGE4000 Plus is the most advanced bond tester on the market. This next generation system represents the industry standard in bond testing and offers unsurpassed accuracy and repeatability of data, providing complete confidence in results. The 4000Plus multi-purpose bondtester performs shear tests up to 200kg, pull tests up to 100kg and push tests up to 50kg, covering all test applications including new hot bump pull and fatigue applications.
The Nordson DAGE4600 Bondtester is designed to eliminate uncertainty by providing a robust fully automated testing solution. This bench top system achieves operator free testing by using a high accuracy stage and on-board camera’s. The system is proven to give ultimate reliability in Bondtesting results, and avoids the risk of human error.
The 4800 has been developed to address the specific needs of wafer bond testing of up to 450mm wafers, including high-speed, high-accuracy X-Y stages, wafer handling from manual to inline solutions, warped and thin wafer capability, vision systems for manual and automated testing, extensive software for reporting and analysis, through precision and multi-function cartridges providing bump test, shear test, pull test capability etc.
FURTHER INFORMATION & REQUEST FORM:
Tel: +44 (0)1264 334505
Semiconductor Defect Analysis & Process Characterisation, Wire Bond Testing, Validation Of Process & Machine Setup, In Process Quality Control, Wire Bond Strength Analysis, Materials Testing, Die Shear & Bond Shear Strength Checks, Bump Wafer Test, Micro-Materials Testing, Fatigue, Creep, Flex-Bend, Crush, Push/Pull etc.
Semiconductor, Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Fibre Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Medical Devices
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark