Inseto's engineering team has developed high levels of knowledge and experience in the implementation of quality support services, including:
All of our work is carried out in accordance with the manufacturers guidelines using comprehensive service checklists, calibrated instruments, OEM warrantied parts and is Certified according to our ISO accreditation & procedures.
Some customer testimonials:
Testimonial 1: Thank you for your recent service intervention; by travelling up the evening before to get an early start on Monday, we were able to resume production earlier following completion of your work.
Testimonial 2: Great training yesterday. Very well received by the guys..!!!
Testimonial 3: The technical support we have received in resolving issues with our dicing saw has been tremendous. The timely intervention has enabled us to meet our customers requirements, this has just led to the purchase of another ADT dicing system from Inseto!
Testimonial 4: Inseto recently provided us with a first service for two pieces of equipment. The service engineer arrived promptly, at the beginning of our working day. The engineer was friendly and well presented. He showed great understanding of the equipment and further complimented our own understanding by sharing some of his. He identified problems that had surfaced during the servicing and made us aware of what to look for in the future. We were completely satisfied with the level of serviced received. Our equipment is now running more efficiently which has subsequently increased yield and the quality of the devices which pass through them, thank-you.
Technical & Application Support
Kulicke & Soffa (K&S) Wire Bonding Equipment
Dage Bond Testers
Dr Tresky Pick & Place Systems
K&S Orthodyne Wire Bonders
ATV Solder & Wafer Processing Equipment
ADT Dicing Saws & Peripheral Machines
Amadyne Pick & Place Equipment
SemiProbe Probing Stations
Plasma Etch Cleaning Systems
FURTHER INFORMATION & REQUEST FORM:
Tel: +44 (0)1264 334505
Semiconductor Wafer Defect Analysis & Characterisation, Validation Of Process & Machine Setup, In Process Quality Control, Wire Bond Strength Analysis, Die Shear & Bond Shear Strength Checks including: Ball Shear/Solder Ball Shear, Cold Bump Pull, Die Shear, First Bond Ball Pull/Stud Bump Pull, High Force Pull, High Strain Rate, Pull, Stud Pull, Tweezer Pull, Zone Shear, Flip Chip Bump Test
Power Device Production, Universities, Research Development, Production, Semiconductor, Medical, Photonics, Solar Cell, Photo Voltaic, RF & Microwave Electronics, Microelectronics etc.
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark