Serving the IC and MCM/hybrid assembly markets, K&S can support your company's roadmap for complex packages and higher productivity and yields at the lowest cost. Together, K&S automatic and manual wire bonders, bonding tools and wire deliver a complete range of product and process solutions designed to maximize your assembly productivity and help keep your company ahead of the technology curve.
K&S is proud to introduce a new generation of semiconductor assembly equipment. We have named this product line the Power Series of Semiconductor Assembly Products, reinforcing both the powerful capability built into these products and the power of K&S as a technology leader for more than five decades.
Fully Automatic Wire Bonding Equipment Overview
IConn High Performance Gold Ball Wire Bonder - Extended Large Area
As its name implies, the IConn High Performance Wire Bonder, represents the state-of-the-art in IC interconnect performance for advanced packaging requirements of both today and tomorrow.
The IConn is built upon the new Power Series platform, with the most powerful X-Y_Z motion control system ever designed for assembly equipment, making it the fastest bonder in its market.
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Microelectronic Devices, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development, Microelectronic Devices, Bio Medical Assembly, Nano-electronics, MEMS Device Interconnect, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development
Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Photonics, Solar Cell, Fibre Optics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities
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