FULLY AUTOMATIC GOLD BALL WIRE BONDERS BY KULICKE & SOFFA (K&S)

Serving the IC and MCM/hybrid assembly markets, K&S can support your company's roadmap for complex packages and higher productivity and yields at the lowest cost. Together, K&S automatic and manual wire bonders, bonding tools and wire deliver a complete range of product and process solutions designed to maximize your assembly productivity and help keep your company ahead of the technology curve.

K&S is proud to introduce a new generation of semiconductor assembly equipment. We have named this product line the Power Series of Semiconductor Assembly Products, reinforcing both the powerful capability built into these products and the power of K&S as a technology leader for more than five decades.

Features include:

  • Upgraded Control System that provides the latest available technology
  • ± 2.0 μm accuracy
  • High performance X-Y-Z motion control system
  • Dual-frequency transducer allows two selectable frequencies for each bond
  • Power Series Advanced Loops for tight control of the last kink height
  • On-board process optimization tools
  • 1pF Auto-BITS self-teach and optimization
  • WAVI (Wide Angle Vertical Illumination) system with programmable red and blue lighting
  • Optional programmable focus with a full 2.5 mm focus range
  • Optional copper wire bonding kit

Fully Automatic Wire Bonding Equipment Overview

Pickup Tips and Collets

IConn High Performance Gold Ball Wire Bonder - Extended Large Area

As its name implies, the IConn High Performance Wire Bonder, represents the state-of-the-art in IC interconnect performance for advanced packaging requirements of both today and tomorrow.

The IConn is built upon the new Power Series platform, with the most powerful X-Y_Z motion control system ever designed for assembly equipment, making it the fastest bonder in its market.

 

FURTHER INFORMATION & REQUEST FORM:

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Microelectronic Devices, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development, Microelectronic Devices, Bio Medical Assembly, Nano-electronics, MEMS Device Interconnect, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development

Industry Segments

Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Photonics, Solar Cell, Fibre Optics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities

Kulicke & Soffa (K&S) Website

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United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark

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Telephone:
+44 (0)1264 334505

Email:
enquiries@inseto.co.uk

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