The new AT PremierPLUS™ Wafer Stud Bumper from K&S offers many technological advantages that make it the ideal choice for a wide range of flip chip product applications.
Using industry-standard modelling, this new generation high-speed stud bumper is the clear cost-of-ownership leader in comparison to competitive stud bumping technology.
Fully Automatic Ball and Wafer Stud Bumping Equipment Overview
K&S AT PremierPLUS™ Ball Stud Bumper
The AT PremierPLUS™ takes stud bumping productivity to a whole new plateau enabling applications that were previously limited to mass solutions. Offering the fastest bumping speeds in the market along with the smallest footprint, AT Premier maximizes the use of resources and clean room space. Stud bumping on the AT Premier platform is flexible enough for rapid prototyping and scalable for production.
Its “premier” performance is highlighted by the following features: Quantum Leap in Bump Speed, Easy-to-Use & Robust Wafer Mapping, Low-Impact Force for Bond Control, Bump Shape Process Flexibility, Short Product Changeover Time, Smallest Footprint In The Market & Step-and-Repeat and Circle Teach Programming.
The AT Premier's unique wafer mapping system helps you reduce production costs by bonding only known good die
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Microelectronic Devices, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development, Microelectronic Devices, Bio Medical Assembly, Nano-electronics, MEMS Device Interconnect, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development
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