Kulicke & Soffa (K&S) are the world leaders for automatic wire bonders. The KnS gold wire bonders, copper stud bump / wire & aluminium ultrasonic wedge bonding systems are very easy to operate and are ideal for universities, development laboratories through to medium volume production facilities.
K&S also produce a range of fully automatic gold ball bonding machines for high speed IC & MCM assembly, flexible large area hybrid markets and stud bumpers for up to 12" wafers, as well as automatic die bonding systems. These systems provide higher productivity and yields, whilst enabling production of the most complex packages at the lowest cost.
Product range overview
The new K&S Orthodyne Asterion Wedge Bonder is suitable for large wire, fine wire and power ribbon bonding of Microelectronic Devices, Interconnection of Chip-on-Board Assemblies, Power Hybrid Modules, Semiconductor Components, Automotive Modules Interconnect, Sensors, Multi-chip-Modules and Ultrasonic Bonding of Battery Packs
The K&S Orthodyne PowerFusion is a cassette to Cassette or inline lead-frame bonder for Power Semiconductor devices. Three models of PowerFusion bonders are available. The TL Model is the perfect choice for bonding TO power devices while the HL Model provides the accuracy and capability required to process the most advanced power packages. The HLx Model can handle extra-wide matrix and IPM lead-frames up to 105 mm wide.
A new level of wire bonding performance. The IConn is built upon the new Power Series platform, with the most powerful X-Y-Z motion control system ever designed for assembly equipment, making it the fastest bonder in its market.
Fully Automatic Ball Bonders:
The new AT Premier™ Stud Bumper from K&S offers many technological advantages that make it the ideal choice for a wide range of flip chip product applications. Using industry-standard modelling, this new generation high-speed stud bumper is the clear cost-of-ownership leader in comparison to competitive stud bumping technology.
K&S is the world's leading manufacturer of advanced bonding capillaries for a broad range of applications from standard to ultra-fine pitch suitable for both Copper and Gold Bonding Wires. K&S Semitec offers a full range of wafer dicing blades and PCB package dicing blades for a wide variety of materials and applications.
FURTHER INFORMATION & REQUEST FORM:
Tel: +44 (0)1264 334505
Microelectronic Devices, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development, Microelectronic Devices, Bio Medical Assembly, Nano-electronics, MEMS Device Interconnect, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development
Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Photonics, Solar Cell, Fibre Optics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities
Kulicke & Soffa (K&S) Website
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark