The new K&S Orthodyne, "Asterion" Automatic Large Area Wedge Bonder is suitable for large wire, fine wire and power ribbon bonding.
The wedge bonder is built on an enhanced architecture that includes an expanded bond area, new robust pattern recognition capabilities and extremely tight process controls. Together these deliver heightened productivity, bonding quality, and reliability. The enlarged bondable area enhances flexibility and reduces line integration costs. Asterion is driven by a precise new direct-drive motion system that requires minimum maintenance and delivers high repeatability. Powerful new software features, like the graphical editor, make programming complex devices easier, and multi-segmented bonding includes flexible tools to deliver an optimized bonding process.
The system features:
FURTHER INFORMATION & REQUEST FORM:
Tel: +44 (0)1264 334505
Wedge Small & large Wire or Power Ribbon Bonding Of Microelectronic Devices, Interconnection of Chip-on-Board Assemblies, Power Hybrid Modules, Semiconductor Components, Automotive Modules Interconnect, Sensors, Multi-chip-Modules, Ultrasonic Bonding of Battery Packs
Semiconductor, Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Fibre Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Medical Devices
Kulicke & Soffa (K&S) Website
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark