K&S Asterion Automatic Wedge and Power Ribbon Bonder

AUTOMATIC WEDGE BONDER: ASTERION

The new K&S Orthodyne, "Asterion" Automatic Large Area Wedge Bonder is suitable for large wire, fine wire and power ribbon bonding.

The wedge bonder is built on an enhanced architecture that includes an expanded bond area, new robust pattern recognition capabilities and extremely tight process controls. Together these deliver heightened productivity, bonding quality, and reliability. The enlarged bondable area enhances flexibility and reduces line integration costs. Asterion is driven by a precise new direct-drive motion system that requires minimum maintenance and delivers high repeatability. Powerful new software features, like the graphical editor, make programming complex devices easier, and multi-segmented bonding includes flexible tools to deliver an optimized bonding process.

The system features:

  • Large bondable area 300x300mm, optional extended version up to 300x800mm
  • Small wire, large wire and power ribbon bonding capability
  • Advanced interconnects with optional configurable bond head (Cu, Al-Cu & ribbon)
  • Faster cycle time with direct-drive XYZT motion system
  • Manual Load, multi-device and multi-lane material handling configurations
  • Loop Former option enables advanced square shaped loop profiles
  • New bond head set-up aid option (GBS)
  • Intuitive graphical user interface (Windows 7 OS)
  • On-board bond process monitoring & SPC reporting
  • Automatic loop control option
  • Front or rear cut deep access bond heads
  • Standalone or inline configuration

Related Products

Power Fusion Automatic Wedge Bonder for Semiconductor Leadframes
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FURTHER INFORMATION & REQUEST FORM:

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Wedge Small & large Wire or Power Ribbon Bonding Of Microelectronic Devices, Interconnection of Chip-on-Board Assemblies, Power Hybrid Modules, Semiconductor Components, Automotive Modules Interconnect, Sensors, Multi-chip-Modules, Ultrasonic Bonding of Battery Packs

Industry Segments

Semiconductor, Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Fibre Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Medical Devices

Technical Papers

K&S Asterion EV Brochure (Large Area - Extended Version)

Kulicke & Soffa (K&S) Website

Region

United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark

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Telephone:
+44 (0)1264 334505

Email:
enquiries@inseto.co.uk

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