Note: This model is no longer manufactured and is only available now as a refurbished system.
The 4522 from MPP (formerly K&S Manual Wire Bonders Division) is now obsolete and available only as a used/refurbished model. Please contact us for further information, available stock or servicing requirements.
The system is an advanced bench-top manual gold ball wire bonder with operator initiated controls and analog adjustments, which allow rapid adjustment of individual bonding parameters.
The system is capable of ultrasonically bonding gold wires from 18 - 75 micron. A system features a large bonding area up to 6 x 6", consistent ball size control via negative EFO, missing ball detection with auto-stop and advanced loop controls. A copper conversion kit is also available.
The 4522 advantages include:
4522 Equipment Features & Specifications
Gold Wire Range:
18 to 76 microns (0.7 to 3 mil/thou)
Copper Wire Range:
18 to 50microns (0.7 to 2 mil/thou)
50.8 mm (2 inch)
152 X 152 mm (6 X 6 inch)
143 mm (5.6 inch)
Gross Table motion:
140 mm (5.5 inch)
Fine Table motion:
14 mm (0.55 inch)
Z motion system:
DC servo / LVDT control
8.4 mm (330 mil) option 12.7 mm (500 mil)
High Q60 KHz Transducer & PLL Ultrasonic Generator
Low Ultrasonic power:
High Ultrasonic power:
Ball Bonding/Bumping 20-200 mSec
Single Point TAB 20-1000 mSec
Force coil 10-160 gr.
Ball formation system:
Missing ball system:
Indication and Auto-stop
Modes of operation:
Semi-Auto, Manual "Z", Ball bonding, Ball Bumping, Single Point TAB and Coining
Integrated up to 250 (+/-0.5) C
FURTHER INFORMATION & REQUEST FORM:
Tel: +44 (0)1264 334505
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Available from Inseto for shipment worldwide.