The iBond5000 manual ball bonder is the latest model from MPP (formerly K&S Manual Wire Bonders Division), for bonding and bumping of gold or copper wires.
The benchtop system features advanced electronics, Windows CE control software and a modern user touch-screen interface. The equipment's mechanical design is based on the proven 4500 series, ensuring high build quality and consistent results.
The system enables saving and loading of custom files, along with factory preconfigured profiles, for storing, cataloging, and re-using golden processes. The bonding profiles internal library, which includes a bonding wires database, further enhances the ease of use. and cater for various applications. The iBond5000 has an abundance of advanced options for improved efficiency and expertise, while also lowering cost of ownership.
The model is ideal for process development, production, research and supplemental manufacturing support. It provides excellent yield and repeatability needed for high-end applications including: Optoelectronic Modules, Hybrids/MCMs, Microwave Products, Discrete Devices/Lasers, Chip-on-boards, Leads, Sensors and High Power Devices etc.
iBond5000 Ball Bonder features include:
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