iBond5000 Convertible Ball and Wedge Bonder
K&S iBond5000 Convertible Wire Bonder


The iBond5000 manual wedge bonder is the latest model from MPP (formerly K&S Manual Wire Bonders Division), for ultrasonic Wedge,Tab, Stitch & Ribbon bonding using aluminium, gold or copper wires.

The benchtop system features advanced electronics, Windows CE control software and a modern user touch-screen interface. The equipment's mechanical design is based on the proven 4500 series, ensuring high build quality and consistent results.

The system enables saving and loading of custom files, along with factory preconfigured profiles, for storing, cataloging, and re-using golden processes. The bonding profiles internal library, which includes a bonding wires database, further enhances the ease of use. and cater for various applications. The iBond5000 has an abundance of advanced options for improved efficiency and expertise, while also lowering cost of ownership.

The model is ideal for process development, production, research and supplemental manufacturing support. It provides excellent yield and repeatability needed for high-end applications including: Optoelectronic Modules, Hybrids/MCMs, Microwave Products, Discrete Devices/Lasers, Chip-on-boards, Leads, Sensors and High Power Devices etc.

iBond5000 Wedge Bonder features include:

  • Ultrasonic Wedge,Tab, Stitch & Ribbon bonding
  • Motorized Y with programmable stepback
  • 30/45 degree wire feed (Deep Access optional)
  • Advanced Wedge automatic wire re-feed
  • Consistent tail length with fine adjust
  • Semi-auto and manual Z operation modes
  • 7" touch-screen TFT graphical user interface
  • Dual-core processor based hardware system
  • USB connectivity for text, mouse, keyboard
  • Storage and retrieval of wire bonding profiles
  • K&S bonding profiles in internal library
  • LED product lighting
  • Large 5.3” x 5.3” bonding area


Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk


Microelectronic Devices, Chip-on-Board Assemblies, Microwave Devices, Multi-Chip-Modules, Semiconductor Components, Development, Microelectronic Devices, Bio Medical Assembly, Nanoelectronics, MEMS Device Interconnect, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development

Industry Segments

Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Photonics, Solar Cell, Nanoelectronics, Fiber Optics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities

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United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark

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