The iBond5000 is the latest generation manual wire bonder from MPP, incorporating Kulicke & Soffa ultrasonic technology, a 7" touch screen control and graphic user interface.
The iBond5000 Convertible ball and wedge bonder is designed for:
Ball, Bump & Wedge bonding gold wires: 17-70 microns dia.
Wedge Bonding Aluminium Wires: 20-75 microns dia.
Ball bonding copper wires: 17-50 microns dia.
Ribbon Bonding: 25 x 250 micron gold ribbon.
Additional features include Ethernet connection for centralised management, the capability to save and load custom files, along with factory preconfigured profiles, for storing, cataloging, and re-using golden processes. A bonding profiles internal library, which includes a bonding wires database, further enhances the ease of use. The iBond5000 also has an abundance of advanced options for improved efficiency and expertise, while also lowering cost of ownership.
The iBond range of manual bonders are used for process development, production, research and supplemental manufacturing support. They provide the excellent yield and repeatability needed for high-end applications including: Optoelectronic Modules, Hybrids/MCMs, Microwave Products, Discrete Devices/Lasers, Chip-on-boards, Leads, Sensors and High Power Devices.
iBond5000 Dual features include:
FURTHER INFORMATION & REQUEST FORM:
Tel: +44 (0)1264 334505
Microelectronic Devices, Chip-on-Board Assemblies, Microwave Devices, Multi-Chip-Modules, Semiconductor Components, Development, Microelectronic Devices, Bio Medical Assembly, Nanoelectronics, MEMS Device Interconnect, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development
Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Photonics, Solar Cell, Nanoelectronics, Fiber Optics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark