PacTech – Packaging Technologies GmbH is a world leading provider of advanced wafer bumping, packaging and solder ball placement equipment used in numerous applications such as micro BGA, wafer level CSP, Optoelectronic (micro optics, fiber attached and lens alignment), Solder stacking (SS Hard drives), MEMS (2D, 2.5D and 3D packaging) and TSV (solder filling of vias).
This range of equipment includes semi automatic and fully automatic Solder jetting, Wafer level Solder balling, BGA and wafer level solder ball rework systems along with Electroless Bumping lines.
As an innovator in the area of Laser Assisted Solder-Jetting process and chip bonding, PacTech also manufacturers UFP Cantilever placement & Laser Bonding systems for Wafer Probe cards, along with Laser Bonding systems for Flip Chip and Capacitor applications
An extensive sub contract service for wafer bumping, wafer back side metalization, and CSP and BGA rework is also available from their Berlin facility.
Product range overview
PachTech manufacture manual, semi-automatic and fully automated solder jetting systems for low through high volume applications, including:
Laser enhanced bonding systems that perform chip placement and assembly reflow simultaneously for Flip Chip, MEMS Bonding / Probe Card, Vertical Chip Bonding applications:
FURTHER INFORMATION & REQUEST FORM:
Tel: +44 (0)1264 334505
MEMS Packaging, Camera Module Fabrication, Memory, FO WLP, Flip Chip Bumping, BGA Solder Ball Placement, Smart phones and Tablet CSP Packaging, Bio Medical Device Assembly, Sub Contract Wafer Dicing, Sub Contract Wafer Bumping, Sub Contract Solder Bumping
Semiconductor Fabrication, Photonics, Bio Medical, Consumer Electronics, Aerospace, Defence
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark, Netherlands, France & Benelux