WAFER - SOLDER BUMPING EQUIPMENT AND SERVICES BY PACTECH

PacTech – Packaging Technologies GmbH is a world leading provider of advanced wafer bumping, packaging and solder ball placement equipment used in numerous applications such as micro BGA, wafer level CSP, Optoelectronic (micro optics, fiber attached and lens alignment), Solder stacking (SS Hard drives), MEMS (2D, 2.5D and 3D packaging) and TSV (solder filling of vias).

This range of equipment includes semi automatic and fully automatic Solder jetting, Wafer level Solder balling, BGA and wafer level solder ball rework systems along with Electroless Bumping lines.

As an innovator in the area of Laser Assisted Solder-Jetting process and chip bonding, PacTech also manufacturers UFP Cantilever placement & Laser Bonding systems for Wafer Probe cards, along with Laser Bonding systems for Flip Chip and Capacitor applications

An extensive sub contract service for wafer bumping, wafer back side metalization, and CSP and BGA rework is also available from their Berlin facility.

Product range overview

 

Link to PacTech website - High Volume Laser Assisted Flip Chip and Bonding Equipment

Laser enhanced bonding systems that perform chip placement and assembly reflow simultaneously for Flip Chip, MEMS Bonding / Probe Card, Vertical Chip Bonding applications:

Wafer Level Bump Plating Equipment

PacTech’s fully automatic electroless nickel plating line (PacLine™ Series 200 and 300) allows the processing of 100-300mm wafers with Ni, Pd and Au at volumes of 600,000 parts per year:

Sub Contract Bumping and Wafer Level Services

PacTech is a worldwide leader in Wafer Level Bumping & Packaging Services. These services meet the high quality demands of customers and support both engineering and prototyping services, as well as high volume production.:

FURTHER INFORMATION ON PACTECH WAFER - SOLDER BUMPING EQUIPMENT AND SERVICES

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

MEMS Packaging, Camera Module Fabrication, Memory, FO WLP, Flip Chip Bumping, BGA Solder Ball Placement, Smart phones and Tablet CSP Packaging, Bio Medical Device Assembly, Sub Contract Wafer Dicing, Sub Contract Wafer Bumping, Sub Contract Solder Bumping

Industry Segments

Semiconductor Fabrication, Photonics, Bio Medical, Consumer Electronics, Aerospace, Defence

Technical Papers

PacTech Website

Region

Available from Inseto in the United Kingdom, Ireland & Scandinavia

Telephone:
+44 (0)1264 334505

Email:
enquiries@inseto.co.uk

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