FEATURES - BENEFITS
The PE-75 Plasma Asher / Plasma Cleaner is our largest entry level plasma treatment system, including all the features of the PE-50-XL, but with a larger circular aluminium vacuum chamber that is 250mm (10") in diameter and 270mm (10.75") deep with a direct powered RF electrode for processing up to 200mm (8") parts.
When fitted with a high power RF source (13.56 MHz), the PE-75 is a popular choice for use as a plasma asher. Although all of our systems are versatile and can perform many tasks without changing configuration settings, the PE-75 is the best value in the industry for plasma ashing; the process of removing photoresist from an etched wafer. When fitted with a lower power RF source (400W 50KHz), the system also excels at plasma cleaning and surface modification applications.
PE-75 features include:
FURTHER INFORMATION & REQUEST FORM:
Tel: +44 (0)1264 334505
Ashing of Semiconductor Photoresist, Stripping Polyimide, Etching Wafers, Cleaning and De-Contamination, Hydrophilic Surface Modification etc.
Research, Development, Universities, Academic, Medical Devices, MEMS, Photonics, Photovoltaic, Semiconductor, Printed Electronics etc.
Plasma Etch Inc. Website
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark, Netherlands, France & Benelux