PE-200 Compact Plasma Etcher

BENCHTOP PLASMA CLEANER FOR LARGE DEVICES / BATCH SIZES - PE200

The PE200 vacuum chamber encloses a generous 3225cm² (500 square inches) of active plasma processing surface, providing increased bond strength and cleanliness of almost any surface material. Etching with our plasma cleaner rather than with chemical baths can also eliminate expensive hazardous chemical waste.

The system is often purchased by small-medium volume production facilities, research and development labs, testing facilities and universities. Industry users include Biomedical, Dental, Electronics, Light Industrial, Medical, Plastics, Optical, Edge Isolation Etch for Solar Cell, and Solar Panel to name a few.

The simple to use, intuitive touch screen interface controls every aspect of the plasma process ensuring repeatability, an optional Windows based control software is also available.

PE-200 features include:

  • Welded Aluminium Vacuum Chamber
  • Three 325mm (13”) wide x 400 (16”) deep electrode shelves
  • Electrode horizontal shelves on 3” spacing
  • 300 Watt RF generator @ 13.56 MHz
  • Automatic Matching Network
  • One 200 SCCM Mass Flow Controller
  • Pirini Vacuum Gauge. Range 0-1 Torr
  • Microprocessor Control System with Touch Screen
  • 20 Recipe storage (Unlimited with Windows option)
  • 29 CFM Oxygen service Vacuum pump
  • 3 Microns Vacuum Pump Oil Filtration
  • Plasma Console 900 x 900 x 800mm (36x36x32”)
  • System Weight 159Kg (350lbs)
  • Vacuum Pump 400 x 800 x 500mm (16x32x20”)
  • Vacuum Pump Weight 82Kg (180lbs)
  • Compressed Air Service 80-100 PSI <0.5 CFM
  • Regulated Process Gases 15-30 PSI

Optional System Features

  • Electrostatic Shielding | Process Temperature Control
  • 600 W RF Generator @ 13.56MHz (A.M.N)
  • 59 CFM Vacuum oxygen service pump (3 phase)
  • Automatic 2 point N2 purge system
  • Signal Light Tower
  • MKS Automatic Throttle Vacuum Controller
  • 2 additional Mass Flow Controllers (total of 3)
  • Software selectable 5 gas input steering matrix
  • Controlled Rate N2 Chamber Purge
  • Oil Mist Coalescing Filter on Vac Pump exhaust
  • Custom Chamber size and configuration
  • Custom Electrode Size and configuration
  • RIE (reactive ion electrode) configuration
  • Windows Operating Software & Recipe Storage

Facility Optional

  • Packed Bed Fume Scrubber
  • Compressed Air Dryer for vacuum pump Purge Gas supply

FURTHER INFORMATION & REQUEST FORM:

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Contamination Removal, Hydrophilic Surface Modification, Surface Cleaning, Surface Preparation, Removal of Hydrocarbons, Organic Materials, Oxides and Sulphides, Small Series Production, MEM's Device Production, Solar Cell Fabrication, PCB Bare Board manufacturing, Nanotechnology, Wafer Level Packaging, Semiconductor Fabrication etc.

Industry Segments

Semiconductor, Biomedical, Research, Development, University, Academic, Medical, Plastic, Glass, Automotive, Dental, Aerospace, PV, Military, Telecommunications, Electronics, Industrial, Photonics, Solar Cell, Nano Devices, Photonics, Microwave, Microelectronic, Printed Circuit Board etc.

Technical Papers

Plasma Etch Inc. Website

Region

United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark, Netherlands, France & Benelux

Full Name

Company

Country

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Message

Telephone:
+44 (0)1264 334505

Email:
enquiries@inseto.co.uk

ISO 9001 Certificate No. 12416