The system is a complete plasma cleaning / Reactive Ion Etching machine designed to be robust and reliable yet inexpensive enough to allow start-up companies, medical labs and R&D facilities the opportunity to experience Plasma Etch technology.
The PE-100 is available in three unique configurations:
The all aluminium chamber features over 1548.4cm² (240 square inches) of active processing surface with the three level standard configuration. The clean design features an industrial powder coated frame to guard your processing environment from contamination.
The system is available with custom electrode configurations including RIE (Reactive Ion Etch) and process temperature control. When using the PE-100 as Reactive Ion Etch the electrodes are specially designed for directional plasma, which means the plasma contacts the substrates in a downward flow or drilling effect. This process is primarily used for drilling microvias or cleaning of small variations that are unattainable with chemicals, since liquid flow is often restricted in these small spaces, such as vias.
PE-100 features include:
Optional System Features
FURTHER INFORMATION & REQUEST FORM:
Tel: +44 (0)1264 334505
RIE Etching of Semiconductor Devices, MEM's Device Production, Solar Cell Fabrication, PCB Bare Board Manufacturing, Nanotechnology, Wafer Level Packaging, Ashing, Contamination Removal, Hydrophilic Surface Modification, Surface Cleaning, Surface Preparation, Removal of Hydrocarbons, Organic Materials, Oxides and Sulphides, Small Series Production etc.
Semiconductor, Research, Development, University, Academic, Medical, Plastic, Glass, Automotive, Aerospace, PV, Military, Telecommunications, Electronics, Industrial, Photonics, Solar Cell, Nano Matrerials, Fibre Optics, Microwave, Microelectronic, Printed Circuit Board etc.
Plasma Etch Inc. Website
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark, Netherlands, France & Benelux