The Turn Table (TT) model is based on Plasma Etch Inc.'s BT-1 Platform, sharing the same robust and reliable features whilst providing enhanced surface modification capabilities, these include rotating active processing and a generously sized circular chamber, which has the option of insulated, or direct on electrode method of treatment.
Loading & processing proves is quick and effective, keeping production rates high, easily meeting demands of even the heaviest process requirements. The vacuum chamber contains two levels of electrodes, measuring up to 600mm / 24" in diameter. The operator simply places product onto electrodes and the systems turntables rotate at a constant speed during the plasma cleaning cycle.
TT standard features include:
Optional System Features
Please contact us for the full range of options.
FURTHER INFORMATION & REQUEST FORM:
Tel: +44 (0)1264 334505
Contamination Removal, Hydrophilic Surface Modification, Surface Cleaning, Surface Preparation, Removal of Hydrocarbons, Organic Materials, Oxides and Sulphides, Industrial Production, Device Production, Solar Cell Fabrication, PCB Bare Board Manufacturing, Semiconductor Device Fabrication etc.
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