SÜSS MicroTec develop and manufacture an extensive range of high-quality manual, semiautomatic and fully automatic wafer coating-developing equipment for lithographic processes used in the R&D and production of semiconductor and related devices.
The manual product line of SUSS MicroTec includes spin coaters, spray coaters and hot plates available in stand-alone or bench mounted configurations.
Semi-automated solutions includes equipment for coating, developing, lift-off and cleaning processes, with models specific for either solvent and aqueous chemistries. These products also offer easy recipe transfer to automated platforms.
SÜSS also specialise in the development and production of fully automated track based cluster tools for up to 200 or 300mm wafers. The systems for resist coating and or developing, can feature up to 3,5 or 6 modules (ACS200), with up to four independent wet process and a maximum of 19 hot plates, to suit the needs of either high-volume manufacturing, or precision low-volume automated processing.
SÜSS equipment is also renowned for its exceptional build quality, high yield, reliability and low cost of ownership.
Product range overview
Manual Spin Coaters
LabSpin systems are high-performance Spin Coaters. They are available in two versions, either up to 150 or 200mm wafers, as a table-top (TT) unit or for integration into a wet bench (BM). LabSpin spin coaters can process a wide range of substrates starting from pieces up to 150/200mm round wafers 100x100mm or 150x150mm squares.
Manual Hot Plate
The HP8 manual hot plate for up to 200mm wafers/substrates has been designed to meet the requirements of R&D work and small scale production and is available in bench mounted, table-top or stand-alone versions.
The hot plate is equipped with lift pins as a standard, which permits convenient and safe substrate handling.
Nitrogen purge and vacuum suction of the substrate can also be individually selected for each step in the recipe editor. The closed double walled lid ensures stable process conditions and prevents accidental touching of the hot surface by the operator.
In addition, the HP8 offers homogeneous temperature distribution by utilising special heating coils, as well as heating ramps with high repeating accuracy, to ensure constant and stable process results.
Semiautomatic Resist Coat and Developers
The RCD8 coat and develop platform can be custom tailored anywhere from e.g. a basic manual spin coater to a GYRSET® enhanced coater and puddle developer tool. It can handle small pieces as well as standard wafers up to 200 mm and serves therefore ideally for daily R&D work up to small scale production.
With its large variety of available chucks and configurations, literally all kind of substrate materials and shapes can be coated and developed on the RCD8. The platform can be equipped with various well proven dispense line and pump configurations for handling resists with viscosities from <1 cps up to 55 000 cps.
For applications with high topographies, the SUSS MicroTec AS8/AS12 is the ideal tool. Substrates up to 200 mm or 300 mm in diameter and square substrates up to 6" edge length can be processed. The system can be equipped with up to two separate spray dispense systems. The sophisticated resist supply system offers unmatched process stability and reproducibility. All spray and cleaning parameters can be programmed in the recipe.
Semiautomatic Developer, Cleaner or Lift-Off Equipment
The AD12 Developer & Cleaner is a flexible semi-automated wet-processing system that offers superior cleaning and developing functions for aqueous media applications, whereas the SD12 Developer & Cleaner is designed for cleaning and developing-lift-off functions for solvent media applications.
The systems feature processing of pieces through single-wafers up to 300 mm, square substrates up to 230 x 230 mm and tape frames for wafers up to 300 mm. The ability to handle various media and processes gives the flexibility needed for switching between applications and makes the tool first choice for research environment and small scale production.
Automatic Cluster Coating-Developing Track Equipment
The SUSS ACS200 Gen3 platform is a fully automated Coater & Developer platform, with the capability of up to 4 wet process modules and a maximum of 19 plates, suits the needs of either volume manufacturing or precision automated processing in R&D applications, of up to 200mm wafers/substrates.
The versatile base frame provides multiple configuration possibilities, e.g. up to 4 wet process modules (either coater and /or developer) with up to 19 plates or 2 wet process modules and 2 spray coater modules with up to 13 plates. With the possibility of stacking up to 3 plates over each wet process module and up to 7 plates in the 5th module, the ACS200 Gen3 allows the maximum module count in its class.
For developing applications, either an aqueous or solvent developer module can be configured. A high variety of different nozzle types are available to match with any process requirement. Optional filter fan units and temperature / humidity control of the tool results in process stability, reproducibility and finally in a high yield.
Additional systems for up to 300mm wafers, with up to 12modules and integration into SMIF based factory automation are also available for high-volume production environments.
FURTHER INFORMATION ON SÜSS MicroTec WAFER COATING EQUIPMENT
Tel: +44 (0)1264 334505
UV Lithography, Wafer Resist Coating with Spin, Spray or Puddle Dispense, Resist Developing, Wafer Cleaning, Metal Layer Lift Off, Baking, Wafer Prime etc.
Wafer level chip-scale packaging, flip chip packaging, bumping, MEMS, LED, power devices, optical components and compound substrates and other semiconductor related device R&D applications
SÜSS MicroTec Website
Available from Inseto in the United Kingdom and Ireland