LITHOGRAPHY & WAFER BONDING EQUIPMENT BY SÜSS MicroTec

SÜSS MicroTec are the manufacturer of the world’s first mask aligner and recognised technology leader, designer and producer of process equipment for backend lithography, wafer bonding and photomask processing.

SÜSS MicroTec provides cost-effective solutions with unsurpassed quality and cutting-edge technology, enabling their customers to maximise yield at high throughput thus reducing cost of ownership.

In close cooperation with research institutes and industry partners SÜSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and Nanoimprint lithography as well as key processes for WLP, MEMS and LED manufacturing. With its global infrastructure for applications and service SÜSS MicroTec supports more than 8,000 installed systems worldwide.

Product range overview

Link

SÜSS MicroTec Mask Aligners
Link

High-resolution lithography systems providing exceptional reliability, maximum light uniformity, including the latest UV-LED light sources and sub-micron alignment accuracy. The product line ranges from lab aligners for piece parts up to 100mm substrates, through 150, 200 & 300mm systems, with optional imprint and bond alignment capability, to automated systems.

SÜSS MicroTec Spin Coaters, Spray Coaters & Developers
Link

SÜSS MicroTec spin coaters and spray coaters have become synonymous with premium performance, ease of use, flexibility and enhanced results. With a complete line of compact and user-friendly resist coating equipment from economic low-volume laboratory tools to high-end production systems up to 300 mm SUSS MicroTec spin coaters and spray coaters enable the formation of resist layers ranging from below 1 µm to over 500 µm.

Wafer Bonders, De-Bonders & Aligners

Wafer Bonders, De-Bonders & Aligners

A range of permanent and non-permanent wafer bonders for MEMS, advanced packaging, 2.5 & 3d integration, power devices and led applications, plus debonders for thin wafer applications.  From manual system for R&D and pilot production, through semi to fully automatic models.  Capabilities include low-high force bonding,  anodic bonding,  thermo-compression bonding, eutectic bonding,  glass frit bonding, fusion & adhesive bonding  etc.

Remanufactured Equipment - SÜSS ReMan

Remanufactured Equipment - SÜSS ReMan

Certified refurbishment of SÜSS MicoTec equipment using manufacturer-specified original parts, restored to its original condition or even adding features to enhance performance e.g. software and optics. Systems are prepared according the original specifications and performance data, incorporate six months warranty, safety feature updates and pre and final acceptance tests etc.  Remanufactured systems are also available for purchase.

FURTHER INFORMATION & REQUEST FORM:

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Wafer and Substrate Lithogrpahy, Wafer Coating and Cleaning Processes of MicroFluidic Devices, Power Semiconductors, MEMS Devices, Compound & GaN, Photonic Components etc.

Industry Segments

Semiconductor Wafer Fabrication, University Research and Development

SÜSS MicroTec Website

Region

United Kingdom and Ireland

Full Name

Company

Country

Email

Message

Telephone:
+44 (0)1264 334505

Email:
enquiries@inseto.co.uk

ISO 9001 Certificate No. 12416