MASK ALIGNERS FOR RESEARCH AND PRODUCTION BY SÜSS MicroTec

SÜSS MicroTec are leaders in the development and production of high-quality Mask and Bond Aligners used by research, development and production facilities worldwide.

Equipped with reliable, precision alignment and high resolution printing capabilities into the submicron range, SÜSS systems are renowned for their small footprint, ease of use, quality of results and long term reliability.

Featuring patented exposure optics with LED or mercury lamp houses, optimal results are achieved in either proximity or contact lithography modes for wafer level chip-scale packaging, flip chip packaging, bumping, MEMS, LED, power devices and other semiconductor related device R&D applications etc.

Product range overview

 

MJB4 Mask Aligner For Small Substrates and Pieces up to 100mm

MJB4 Mask Aligner for Pieces, Small Substrates and Wafers up to 100mm

The compact, easy to use MJB4 provides unsurpassed results and is perfect for research and low volume photolithography applications. System features and capabilities include:

 

- Processing of fragile, warped or part wafers and pieces from a few millimetres up to 100mm

- Compact robust design, ideal for research environments with resolution down to 0.5 microns

- UV250/300/400 Broadband optics with fast switching between different wavelengths

- Precision alignment with either split or single field microscopes with an IR alignment option

- Wedge Error Compensation (WEC) for optimal parallelism between substrate and mask

- Upgradable with a retrofit kit for UV-Nanoimprint Lithography

MA6 Mask Aligner For Small Substrates and Pirces up to 150mm

MA6 Mask Aligner for Pieces, Small Substrates and Wafers up to 150mm

The compact, easy to use MA6 is a manually loaded system that sets the benchmark in semiconductor submicron research and microsystems production. It is available in three different models, dependent upon the customers applications and requirements. Features and capabilities include:

 

- Processing of fragile, warped or part wafers and pieces from a few millimetres up to 150mm

- Top side, bottom side & infrared alignment capabilities

- UV250/300/400 Diffraction-reducing exposure optics with fast switching between different wavelengths

- Precision alignment with either split field microscope or video based targeting

- Wedge Error Compensation (WEC) for optimal parallelism between substrate and mask

- Optional Bond Alignment, UV-Nanoimprint Lithography capability

MA8 Mask Aligner For Small Substrates and Pirces up to 200mm

MA8 Semiautomatic Mask Aligner for up to 200mm

The semiautomatic MA8 is a manually loaded system that offers maximum flexibility for research and development or production processes. Available in two different configurations with leading edge technology, features and capabilities include:

 

- Processing of fragile, warped or part wafers and pieces from a few millimetres up to 200mm

- LED or Mercury lamp houses with excellent uniformity over the full exposure area

- Software to provide simulation and optimisation of the entire lithographic process

- Automated pattern recognition and alignment capability

- Sophisticated wedge Error Compensation (WEC) for optimal parallelism between substrate and mask

- Options include: Bond Alignment, SCIL / SMILE / UV-NIL Nanoimprint capability, Selective Plasma etc.

MA12 Mask Aligner For Small Substrates and Pirces up to 300mm

MA12 Operator Assisted Mask Aligner for Substrates and Wafers up to 300mm

The MA12 is an operator-assisted Mask Aligner for industrial research and production applications. With its flexible handling and process control features the MA12 is the right tool of choice for advanced packaging applications, features include:

 

- Processing of fragile, warped and thin wafers up to 300mm

- Assisted manual wafer handling with automated processing, including TSA & BSA

- Transition of processes to fully automated tools (MA300)

- Proximity Lithography, Soft Contact, Hard Contact & Vacuum Contact Exposure modes

- Automated filter option for up to four filters that are selected via process recipe

- Excellent light uniformity over the full exposure area

MA150 Automatic Mask Aligner For Substrates and Wafers up to 150mm

MA100/150 Automatic Mask Aligner for Substrates and Wafers up to 150mm

The MA100/150e Gen2 for Compound Semiconductor, HB-LEDs, Power Devices, RF-MEMS devices etc., enables exceptional process scalability with an industry leading throughput of 145 wafers per hour, features and capabilities include:

 

- Optimised for up to 150mm (6") wafers

- Multi-size tooling minimises time required for wafer size changes

- Simultaneous handling of 3 wafers allows > 145 wph. including auto-alignment and exposure

- Alignment function tailored for LED manufacturing, providing optimal contrast for different wafer types

- The 'Line Alignment' function for sapphire wafers aligns scribe lines precisely to the photo mask

- SUSS Diffraction Reducing Optics allows proximity printing for challenging resolution requirements

MA200 Automatic Mask Aligner For Substrates and Wafers up to 200mm

MA200 Automatic Mask Aligner for Substrates and Wafers up to 200mm

The MA200 Gen3 offers intelligent solutions for high volume applications. Its various alignment options, flexible optics and special add-ons make it an all-purpose tool for multiple handling and processing needs. Features and capabilities include:

 

- Compact, space saving design, ideal for production environments on up to 200mm wafers

- Excellent ergonomics and ease of use for setup and operation

- Automatic mask management system stores up to 20 photomasks in a controlled environment

- For an integrated lithography solution the MA200 Gen3 allows clustering with a coat/bake/develop module

- Options include: Flow box, Angular exposure of Steep to Perpendicular Sidewalls, SECS-II/GEM etc.

FURTHER INFORMATION & REQUEST FORM:

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

UV Lithography, Wafer Bond Alignment, Wafer Bonding

Industry Segments

Wafer level chip-scale packaging, flip chip packaging, bumping, MEMS, LED, power devices, optical components and compound substrates and other semiconductor related device R&D applications

Region

United Kingdom and Ireland

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Telephone:
+44 (0)1264 334505

Email:
enquiries@inseto.co.uk

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