MANUAL DIE ATTACH AND DIE SORT EQUIPMENT BY TRESKY AG
Since 1980, Tresky AG has been supplying the micro and opto electronics industry with innovative component placers, die bonders and sorters. Over 1000 units throughout the world have been installed to meet critical process and placement requirements. Inseto provides full technical and application support for Tresky equipment throughout the United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark.
Tresky AG designs and manufactures high quality manual and semiautomatic equipment for applicartions including: Epoxy and Eutectic Die Attach, Laser Diode Manufacturing, Sensor Development and Production, Hybrid Circuit Assembly, MCM, COB, Flip-Chip, Optoelectronic, Microsystems and many more.
Product range overview
Link
The T-4909 is a manual low cost, high quality die bonder with superior ergonomic design. As with all of Tresky’s products, the T-4909 incorporates True Vertical Technology™ which guarantees parallelism between the chip and substrate at any bond height.
Excellent performance, ergonomic design and high reliability make the T-3000 Series ideal for small and medium production and various development applications. The optional automated Z-Drive with bond force control, enables a high repeatability of bond parameters.
Flip chip die bonding systems for die bonding bumped die, or for devices requiring high-precision, device-to-device alignment. Manual, semi-automatic and fully automatic flip chip die attach equipment for anisotropic, thermosonic and solder bump bonding of semiconductor devices etc.
Incorporates semiautomatic process capabilities for low or high bonding forces with precise placement. The T-3000-HF is specially designed with a motorised Z axis that can provide accurate control of the bond forces up to: 25Kg or 50Kg.
FURTHER INFORMATION & REQUEST FORM:
Contact Us
Tel: +44 (0)1264 334505
Email: enquiries@inseto.co.uk
Applications
Microelectronic Devices, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development, Bio Medical Assembly, MEMS Device Attach, Chip-on-Board Die Attach, Multi-Chip-Module Assembly, Semiconductor Assembly, Device Development, RFID, MOEMS, VCSEL, Eutectic Die Attach, Adhesive Die Bonding
Industry Segments
Semiconductor, Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Medical Devices
Tresky Website
Region
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark
Back to top