Tresky manufacture manual, semi and fully automatic Flip Chip Bonders for die attach of bumped chips, or devices requiring high-precision, device-to-device alignment. Die can be picked from up to 200mm (8") semiconductor wafers, waffle pack or GEL pak, in addition to passive components. Processes include Anisotropic (ACA) adhesives, gold bump thermosonic bonding, solder bump reflow etc.
For bump or device alignment, manual and semi-automatic systems incorporate beam splitter optics, which allows the simultaneous viewing of two objects by an optical overlay. Using an optical shutter each of the objects (upper, lower or both) can then be displayed simultaneously on a monitor. The combination of high magnification optics, LED illumination and XY-Table Micro Positioning, result in alignment accuracies of up to 1μm being achieved. Automatic flip chip equipment features precision optics and upward looking cameras to achieve the same objective.
Additional features can include flip stations for applications that also require device inversion prior to placement, flux dip stations, integrated dispense, epoxy stamping, ultrasonic and eutectic heated stages etc.
Whilst the T-3002 is a semi-manual flip chip die bonder, the automatic T-6000-L & T-8000 models are designed for applications that require more automated processing. Please contact us with your application requirements.
FURTHER INFORMATION & REQUEST FORM:
Tel: +44 (0)1264 334505
Flip Chip Die Attach, Thermosonic Die Bonding, High Precision Device Bonding, Stacked Die Bond, Multi-Chip-Module Assembly, Bio Medical Assembly, MEMS Device Interconnect
Semiconductor, Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmar