High Force Die Bonder - Tresky T-3000-HF

HIGH FORCE DIE BONDER: TRESKY T-3000-FC3-HF

The T-3000-FC3-HF (High Force) Manual Die Bonder is an operator controlled machine for attaching semiconductor devices that require bond forces up to 25 or 50Kg. The system is used for bonding devices using flip chip, anisotropic adhesives, thermosonic, ultrasonic or related processes.

The sophisticated design of the HF-module in combination with the TRESKY True Vertical Technology, ensures an absolute co-planarity between chip and substrate at any height and force during bonding process. The automated Z-Drive with bond force control enables a high repeatability of bond parameters.

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Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Microelectronic Devices, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development, Bio Medical Assembly, MEMS Device Interconnect, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development, RFID, MOEMS, VCSEL, Eutectic Die Attach, Adhesive Die Bonding

Industry Segments

Semiconductor, Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Medical Devices

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United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmar

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Telephone:
+44 (0)1264 334505

Email:
enquiries@inseto.co.uk

ISO 9001 Certificate No. 12416