The T-3000-FC3-HF (High Force) Manual Die Bonder is an operator controlled machine for attaching semiconductor devices that require bond forces up to 25 or 50Kg. The system is used for bonding devices using flip chip, anisotropic adhesives, thermosonic, ultrasonic or related processes.
The sophisticated design of the HF-module in combination with the TRESKY True Vertical Technology, ensures an absolute co-planarity between chip and substrate at any height and force during bonding process. The automated Z-Drive with bond force control enables a high repeatability of bond parameters.
FURTHER INFORMATION & REQUEST FORM:
Tel: +44 (0)1264 334505
Microelectronic Devices, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development, Bio Medical Assembly, MEMS Device Interconnect, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development, RFID, MOEMS, VCSEL, Eutectic Die Attach, Adhesive Die Bonding
Semiconductor, Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Medical Devices
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmar