Tresky T-3000 Series Manual Die Bonding Systems

TRESKY T-3000 SERIES MANUAL DIE BONDING SYSTEMS

The T-3000 Series Manual Die Bonders are high precision, operator controlled machines for picking and placing bare semiconductor devices from wafer or waffle pack or GEL pak (model dependant), passive components and other devices used in Microelectronic and related assemblies. The equipment features superior ergonomic design, high accuracy, large assembly area and Z travel, making them ideal for small to medium production and various development applications or custom assembly requirements.

Applications include:

  • Assembly of Hybrid Microelectronic Devices
  • Conductive & Non Conductive Epoxy Die Attach
  • Eutectic Soldering of Devices
  • Flip Chip Bonding
  • Thermo-compression & Ultrasonic Bonding
  • Epoxy Dispense or Stamping
  • Laser Bar Stacking
  • PCB Chip-on-Board etc.
  • Die Sorting to Waffle or Gel Pak

The FC3 equipped systems incorporate a motorised Z axis, providing active force measurement on every pickup and placement removing operator induced variation, which is ideal for the bonding of delicate devices and for providing precise control of bondline thickness.

All models feature Treskys' True Vertical Technology™, which guarantees parallelism between chip and substrate at any bond height, plus integrated time/pressure dispensers.

The modular T-3000 Series also includes an extensive range of options, comprising: Beam splitters for Flip-chip applications, Eutectic Scrub & Gas Heating for Eutectic Die Attach, Solder / Epoxy Dispenser, Epoxy Stamping, Pickup Tool Heating, Ultrasonic Bond Heads, Secondary Preform Spindle, Waffle & Gel Pak Tooling, Substrate Holders, Static and Dynamic Heating Plates and alignment / inspection options.

FURTHER INFORMATION & REQUEST FORM:

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Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Microelectronic Devices, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development, Bio Medical Assembly, MEMS Device Interconnect, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development, RFID, MOEMS, VCSEL, Eutectic Die Attach, Adhesive Die Bonding

Industry Segments

Semiconductor, Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Medical Devices

Tresky Website

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United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmar

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Telephone:
+44 (0)1264 334505

Email:
enquiries@inseto.co.uk

ISO 9001 Certificate No. 12416