The T-4909 Low Cost Manual Die Bonder is a high quality die bonding system with superior ergonomic design. As with all of Tresky’s products, the T-4909 incorporates True Vertical Technology™ which guarantees parallelism between the chip and substrate at any bond height. The T-4909 manual semiconductor die bonder is suitable for die attach of:
The ergonomically designed T-4909 is simple to use and operate, provides excellent performance, high-reliability and is ideal for small and medium volume production, research, development and Universities, where users require a small footprint, quick system setup and accurate placement capability.
The equipment features the following capability/options: Tresky's True Vertical Technology™, Z-movement of 60mm with a 360° rotating pickup tool, adhesive / solder dispenser, epoxy stamping, eutectic scrub, pickup tool heating, secondary preform spindle, XY air-cushioned placement stage with micrometre control, which supports the waffle-gel packs, substrate holder and various heating plates.
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Tel: +44 (0)1264 334505
Microelectronic Devices, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development, Bio Medical Assembly, MEMS Device Interconnect, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development, RFID, MOEMS, VCSEL, Eutectic Die Attach, Adhesive Die Bonding
Semiconductor, Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Medical Devices
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmar