The Nordson DAGE 4800 is at the forefront of manual through automated wafer bond testing technology, catering for the shear and bump testing of wafers from 200mm up to 450mm.
Utilizing proven technology from the 4000Plus Model, the most advanced bond tester on the market, the 4800 is a truly unique wafer level bond tester. In addition, existing cartridges, where applicable, used on the 4000 and 4000Plus bondtesters are also compatible with the 4800 system. Test methods include bump shear, bump pull, hot bump pull, device shear etc.
Intuitive and intelligent Nordson DAGE Paragon™ software provides the ultimate flexibility for the creation and mapping of wafers, enabling quick and precise setup of test patterns. The virtual images for each test pattern enable easy editing.
Integration with a wafer handler transforms the Nordson DAGE 4800 into a fully automated system ensuring reliable and repeatable operation. This integration provides several benefits including the automated loading of warped, thin or bowed wafers. The system also supports multiple wafer sizes subject to specification.
Dage 4800 Wafer Level Bond Tester overview
Ultimate Shear Height Accuracy
Control of shear height (step back) is critical to consistent test results. Nordson DAGE’s unique patented anti-backlash system aids setting and control of step back. Shear height can be set and maintained to single micron accuracy across the range of load cartridges. On the S25G load cartridge the step back accuracy is +/- 0.25 microns. The accuracy is qualified through laser measurement.
Flexible Wafer Map Creation
Nordson DAGE Paragon™ test software provides the ultimate flexibility for wafer map creation enabling quick and precise set-up of test patterns; with virtual images for each test pattern allowing for easy editing. The software also boasts a highly configurable and intuitive interface, built-in diagnostics, a unique database search engine wizard and superior reporting.
Wafer Chuck Features
Secure wafer placement is assured due to the wafer being fully supported at the edges which eliminates lateral movement. The Paragon™ software also provides feedback on the vacuum clamping pressures therefore preventing damage to the wafer.
FURTHER INFORMATION & REQUEST FORM:
Tel: +44 (0)1264 334505
Semiconductor Wafer Defect Analysis & Characterisation, Validation Of Process & Machine Setup, In Process Quality Control, Bump Bond Strength Analysis, Cu Pillar Test, Pull/Stud Bump Pull, Zone Shear, Flip Chip Bump Test etc.
Semiconductor Wafer Level Fabrication
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark