ADT manufacture a wide selection of annular dicing blades & accessories for your most challenging applications. Their blade selection is comprised of three product families distinguished by the type of binder: Resin-bond Blades, Nickel-bond Blades and Metal-bond (Sintered) Blades.
The dicing blades are composed of abrasive materials embedded in either resin or metal matrix. Resin bond Blades are cured under pressure and high temperature, Metal-bond Blades are sintered and Nickel-bond Blades are manufactured using a tightly controlled electroforming process.
Dicing Blade Overview
Available for all blade types in the range of 2"- 5". ADT's extensive line of flanges exhibits high-accuracy, excellent performance, ease-of-use and affordability, including:
Related ADT Dicing Products
Advanced Dicing Technologies Ltd. (ADT) is a world leader in the development and manufacture of dicing saws and laser scribing systems, dicing blades and processes used in the dicing of Silicon-based Semiconductor Wafers and hard materials including Glass, Ceramics, Ferrites, MEMS and in package singulation.
FURTHER INFORMATION & REQUEST FORM:
Tel: +44 (0)1264 334505
Dicing Semiconductor Wafers and Cutting Hard Materials, Cutting Precision Metal Parts, Dicing Thin Film Substrates, Cutting Ferrites, Scribing & Dicing Ceramic, Cutting Glass & Glass Filters, Dicing MEMS, Package Dice, PCB Separation, Universities Wafer Processing, Passive Component Manufacturing, Medical Devices, Glass Filter Cutting etc.
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices, Glass Device Processing etc.
Available from Inseto in the United Kingdom, Ireland & Nordic Region