METALISED THIN FILM CIRCUITS BY ATP

ATP manufactures high quality thin film circuits using a build-to-print service with a wide range of materials and metallisation schemes. Circuits are fabricated on substrates such as Alumina, Beryllia, AlN, Fused Silica, Sapphire, and even on Silicon, with metalisations from the standard TaN/TiW/Au to films including Nickel, Palladium, or Titanium. Circuit features can include fine pitch conductors, integrated resistors, vias, wraparounds, double-sided pattering, and air-bridges.

ATP has in-house capabilities in mask-making, sputtering, plating, imaging, etching, and dicing. To facilitate customer development, up to eight different design options can be produced with a single mask. Prototype volumes can be as low as the quantity on a single 50mm x 50mm (2” x 2”) substrate. Higher-volume production is carrier out in state-of-the-art facilities in North America or China.

Products are manufactured to customer requirements for applications that include RF, microwave & millimetre wave, fibre-optic, and hi-rel products. Markets include wireless communications, defence, aerospace and satellite communications, medical electronics, and the fibre-optic industry.

  • Complete In-House Thin-Film Circuit Fabrication Service
  • Pattern Generated Photomasks
  • In-House Resistor Laser Trimming and CO2 Laser Drilling
  • Multiple Sputtering Systems and Plating Capabilities
  • Air Bridges/Crossovers with Polyimide and Solder Dams
  • Wide Selection of Materials and Metallizations
  • Hollow Plated and Solid Filled Via Capabilities
  • AI203, AIN, BeO, Fused Silica/Quartz, Sapphire and Hi-K Dielectrics
  • Multiple Part Number Array (Pizza Array) Capability
  • Quick Turn Engineering Prototypes
  • Pre-deposited Gold/Tin (Au/Sn)
  • High-Rel Screening: Bond Pull, Die Shear, Temp Shock, Temp Cycle, Burn In per MIL-PRF-38534
  • AS9100 Certified and ISO 9001:2008 Certified

Product range overview

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Thin Film Circuit Manufacturer, Advanced Thinfilm Products - ATP

High-quality "Thin-Film Circuits" manufactured with a quick turn-around according to customers specific requirements, utilising a wide Selection of materials including AI203, AIN, BeO, Fused Silica/Quartz, Sapphire and Hi-K Dielectrics with bondable and solderable metallisation's etc.

FURTHER INFORMATION & REQUEST FORM:

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Thin Film Substrates, Thin Film Metalised Blocks, Thin Film Devices, Laser Diode Sub Mounts, Photodiode Mounts, Chip Mounts, Wire Bond Standoffs, Cooler Spacers, Ceramic Spacers, Microwave Metalized Circuits, RF Circuits, High Frequency Devices

Industry Segments

Military & Aerospace, Telecommunications, Fibre Optics, Photonics, Microwave Electronics, Microelectronics, Space & Research, General Power Electronics, Concentrated Photovoltaics (CPV), Military & Aerospace, Avionics, Automotive, Renewable Energy, Mass Transit etc.

Technical Papers

Thin Film Circuit Guidelines - This document defines the design rules for the thin film circuits and applies to all thin film circuits manufactured by Applied Thin-Film Products.

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Laser Resistor Trim Guidelines - This document defines the design rules for laser trimming tantalum nitride resistors on thin film circuits and applies to all laser-trimmed resistors manufactured by Applied Thin-Film Products.

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Polyimide Bridge Design Guidelines - This document defines the design rules for polyimide bridges and applies to all polyimide bridges manufactured by Applied Thin-Film Products.

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ATP Website

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Available from Inseto in the United Kingdom, Ireland & Nordic Region

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Telephone:
+44 (0)1264 334505

Email:
enquiries@inseto.co.uk

ISO 9001 Certificate No. 12416