Coining Cover Assemblies (package lids) offer many advantages for hermetic sealing processes of electronic packages over techniques using separate solder preforms and covers. The base material, either Kovar™ or Alloy 42, is electroplated with nickel for solderability and to prevent corrosion in the future. The base is then electroplated with gold to provide a highly solderable surface. Finally, the solder preform is welded to the base.
Cover Assembly Base Composition: Alloy: Typically Kovar™ or Alloy 42. Aluminum alloys, Titanium and Stainless Steel are available upon request.
Plating: Typically Nickel plating per QQ-N-290, 50 – 350 micro-inches thick followed by Gold electroplating per MIL-G-45204, Type III, Grade A, 50 micro-inches thick minimum. Alternate plating schemes, including four layer plating and customer specific thicknesses, are available upon request. Base will meet the requirements of MIL-M-38510.
Cover Assembly Processing Information: We recommend a typical clip force of 0.9-2 lbs. Clip force varies depending on lid cover size, preform thickness, lid flatness, and seal-ring flatness. Typical sealing profiles allow for 2-5 minutes above 280 C (melting temperature) with a peak temperature not exceeding 340 C in dry nitrogen, or hydrogen.
FURTHER INFORMATION & REQUEST FORM:
Tel: +44 (0)1264 334505
Hybrid Packages Sealing, Ceramic Lid Attach, Hermetic Component Covers, Microelectronic Device Lids, High Reliability Devices
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonics Components, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices
Available from Inseto in the United Kingdom, Ireland & Nordic Region