Coining are a diverse world class manufacturer of interconnect solutions for the microelectronics industry. Their products are currently divided into several groups: bonding wire & ribbon in gold, silver, aluminium, copper etc.; precision stampings in a wide range of metals; clad to other metals or solder alloys; preforms and ribbon in all solder compositions and package cover lid assemblies.
They are a leading provider of quality fine gold wire, aluminium and alloyed wire, which is sold to a diverse customer and application base, including hybrid, medical and automotive manufacturers. Coining's special proprietary wire alloys and doping recipes, combined with its extensive wire manufacturing capabilities in the US and Malaysia, make their products the preferred choice for their global customers.
Coining manufactures high precision metal stampings and clad materials used to solder or connect electronic circuitry, dissipate heat, or provide an interface for an electronic connection. Many of their products are supplied in tape on reel or waffle pack for robotic loading, and are packed in a Class 10,000 clean room.
In 2009, Coining acquired Semiconductor Packaging Materials (SPM) and in May 2011, Coining itself was acquired by AMETEK, Inc., a large public corporation with annual revenues approaching $3 billion and headquartered in Berwyn, PA near Philadelphia, USA. Coining is now part of AMETEK's Precision and Engineered Materials Business Unit within AMETEK Specialty Metal Products.
Coining is qualified to ISO 9002, QS9000 and ISO14001 and serves the following industries:
Product range overview
Gold Wire 99.99%, Large Aluminium Wire to 99.999%, Fine Aluminium Wire with 1% Silicon, Aluminium Wire with 0.5% Manganese, and Silver, Nickel and Copper bonding wires & ribbons.
An extensive range of solder preforms and ribbons, specialising in Gold and Indium based alloys. A wide range of tooling exists, allowing the customer to keep costs to a minimum.
Precision metal stampings and clad metal or clad solder metal parts. Typical products include Aluminium clad Copper bond pads, Copper / Invar / Copper ribbon and preforms, and Gold / Germanium (88/12) clad Kovar discs.
Cover Assemblies used to hermetically seal electronic packages. The lids have pre-attached solder preform and are electroplated for solder-ability and to prevent corrosion.
FURTHER INFORMATION & REQUEST FORM:
Tel: +44 (0)1264 334505
Wire Bonding, Ribbon Bonding, Die Bonding, Material Interconnect, Heat Dissipation, Thermal Interface, Package Construction & Sealing, Attaching, Soldering etc.
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonics Components, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices
Available from Inseto in the United Kingdom, Ireland & Nordic Region