ADHESIVES FOR MICROELECTRONIC APPLICATIONS

DELO adhesives are used in a vast range of microelectronic applications including die attach, IC glob-top encapsulants, dam / fill materials, plus light activated and light cured adhesives for encapsulation, sealing and joining.

As well as traditional die attach adhesives such as conductive (DA375) & non-conductive (DA358) epoxies, DELO has developed dual-curing silver epoxy (IC343) that cures by a combination of UV & heat, or just by heat alone. UV-curing the fillet around the die immediately after component placement guarantees that movement of the die during heat cure in eliminated. This results in improved placement accuracy at repeatable levels. It can also enable off-line heat curing, thereby saving costly in-line processing time.

Delo also offers non-conductive epoxies for component-attach where electrical conductivity is not required. DELO-DUALBOND OB749 & OB787 offer the same advantage of the IC343 silver-filled epoxy, and also meet the stringent outgassing requirements of both ESA & NASA test methods, ECSS-Q-70 02 & ASTM E 595-93.

Detailed below are some examples, however if your particular requirement is not listed, please contact us for further information, as it is more than likely that a similar requirement has been solved before.

Product range overview

Die Attach Adhesives

Die Attach Adhesives

Reliability is paramount in microelectronic applications, whether the adhesive is used in military or commercial products. Delo’s high-purity, low CTE adhesives provide the perfect combination for use in all applications.

Product

Viscosity

Description

Download

Product

IC343

Viscosity

30,000

Description

Conductive die-attach epoxy, one part, UV & heat cured for very high placement accuracy, fast curing, suitable for bonding to FR4 & flex circuits, dispensing only

Product

OB749

Viscosity

14,000

Description

Non-conductive die attach epoxy, one-part, UV and / or heat cured for very high placement accuracy, fast curing, complies with NASA outgassing requirements, ideal for use in electronic applications

Product

OB787

Viscosity

150,000

Description

Non-conductive die attach epoxy, one-part, UV and / or heat cured for very high placement accuracy, fast curing, fluorescent for in-line inspection purposes, ideal for use in electronic applications

Product

AC245

Viscosity

33,000

Description

Anisotropic (Z-axis) Conductive Epoxy for flip-chip / BGA bonding, one part, heat cured, fast curing, nickel-filled (5.3µm particle size), low ionic impurities, excellent adhesion to FR4 & PET

Product

AC265

Viscosity

26,000

Description

Anisotropic (Z-axis) Conductive Epoxy for flip-chip / BGA bonding,, one part, heat cured, fast curing, gold-over-nickel particles (2.5µm), low ionic impurities, excellent adhesion to FR4 & PET

Product

AC268

Viscosity

32,000

Description

Anisotropic (Z-axis) Conductive Epoxy for flip-chip / BGA bonding,, one part, heat cured, fast curing, nickel-filled (5.3µm), low ionic impurities

Product

AC365

Viscosity

40,000

Description

Anisotropic (Z-axis) Conductive Epoxy for flip-chip / BGA bonding,, one part, heat cured, fast curing, gold-over-nickel particles (2.5µm), low ionic impurities

Product

NU257

Viscosity

29,000

Description

Non-Conductive Epoxy for flip-chip / BGA bonding,, one part, heat cured, fast curing, low ionic impurities

Product

AD340

Viscosity

12,000

Description

Non-conductive die-attach epoxy, one part, UV & heat cured for very high placement accuracy, fast curing, suitable for bonding to leadframes, FR4 & flex circuits, dispensing only

Product

DA255

Viscosity

25,000

Description

Non-conductive die-attach epoxy, one part, heat cured, fast curing, suitable for bonding to leadframes, FR4 & ceramic substrates, low ionic impurities

Product

DA358

Viscosity

30,000

Description

Non-conductive die-attach epoxy, one part, heat cured, fast curing, suitable for bonding to FR4, plastic & ceramic substrates, low ionic impurities, dispensing only

Product

DA375

Viscosity

39,000

Description

Conductive die-attach epoxy, one part, heat cured, fast curing, suitable for bonding to leadframes, FR4 & ceramic substrates, low ionic impurities, dispensing only

Product

IC343

Viscosity

30,000

Description

Conductive die-attach epoxy, one part, UV & heat cured for very high placement accuracy, fast curing, suitable for bonding to FR4 & flex circuits, dispensing only

Product

DA587

Viscosity

70,000

Description

Non-conductive die-attach epoxy, one part, heat cured, fast curing, suitable for bonding to FR4 & plastic substrates, low ionic impurities

Product

MK055

Viscosity

23,000

Description

Non-conductive die-attach epoxy, one part, heat cured, very fast curing, suitable for bonding to FR4 & plastic substrates, complies with NASA outgassing requirements, extended pot life

Product

MK096

Viscosity

Pasty

Description

Non-conductive component-attach epoxy, one part, heat cured, fast curing, suitable for bonding to FR4 & plastic substrates, low ionic impurities

Encapsulation Glob Top Adhesives

Encapsulation Glob Top Adhesive

Protecting bare silicon die is done in a variety of ways, by over-moulding in traditional semiconductor packaging, in metal hermetic packages, or by encapsulation on organic substrates.

Product

Viscosity

Description

Download

Product

GE785

Viscosity

135,000

Description

IC Dam epoxy, one part, heat cured, high Tg, low CTE, operating temperature from -65ºC to +180ºC, compliant to JEDEC MESL1, passes to UL94 HB

Product

GE725

Viscosity

6,500

Description

IC Fill epoxy, one part, heat cured, high Tg, low CTE, operating temperature from -65ºC to +180ºC, compliant to JEDEC MESL1, passes to UL94 HB

Product

GE727

Viscosity

11,000

Description

IC Fill & Glob-top epoxy, one part, heat cured, high Tg, very low CTE, operating temperature from -65ºC to +180ºC, compliant to JEDEC MESL1, passes to UL94 HB

Product

GE730

Viscosity

9,000

Description

IC Fill & Glob-top epoxy, one part, heat cured, high Tg, low CTE, operating temperature from -65ºC to +180ºC, compliant to JEDEC MESL1, passes to UL94 HB

Product

GE765

Viscosity

22,000

Description

IC Glob-top epoxy, one part, heat cured, high Tg, low CTE, operating temperature from -65ºC to +180ºC, compliant to JEDEC MESL1, passes to UL94 HB

FURTHER INFORMATION & REQUEST FORM:

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Bonding, Glob-Top, Encapsulation, Z-Axis Bonding, Sealing, Potting, Underfill, Protection Against Vibration, Conductive Electrical Connection, Underfill, Dam & Fill

Industry Segments

Microelectronic / Hybrid Assembly, Semiconductor Assembly / Back-end Assembly etc., Fibre Optics, Photonic Assembly, Microwave Electronics, OEM Equipment Manufacturers, Precision Components & Assemblies, PCB Assembly, Electronic Component / Device Assembly, Smart Cards, Smart Labels, RFID, Automotive Electronics etc.

DELO Website

Region

Available from Inseto in the United Kingdom & Ireland

Full Name

Company

Country

Email

Message

Telephone:
+44 (0)1264 334505

Email:
enquiries@inseto.co.uk

ISO 9001 Certificate No. 12416