BONDING CAPILLARIES & DICING BLADES BY KULICKE & SOFFA

Kulicke and Soffa (K&S) is the world's leading manufacturer of advanced bonding capillaries for a broad range of applications from standard to ultra-fine pitch copper and gold wires, designed to suit all major brands of wire bonding equipment.

K&S (formerly known as Semitec) offers a full range of hub dicing blades for a variety of advanced material applications. Nearly three decades of experience in sophisticated blade technology have shown that meeting the desired objectives for cut quality, throughput and blade life requires matching the material to be cut with the appropriate blade composition and geometry.

Product range overview

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Ball Bonding & Bumping Capillaries

Ball Bonding & Bumping Capillaries

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K&S produce an extensive range of capillaries for Au & Cu wire, from large pitch (120 µm pad pitch) through ultra-fine pitch (35-50 µm) applications. K&S capillaries are continuously developed to improve bond process reliability, equipment performance, looping characteristics, longevity and yield.

Hub Dicing Blades

Dicing Blades

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K&S produce high-quality hubbed dicing blades for package and wafer singulation, which incorporate the latest technology to enhance lifetime, cut quality and process stability.

The range of dicing blades for cutting silicon wafers feature grit sizes, diamond concentrations, bond hardnesses and hub configurations, optimised to deliver maximum cut quality, throughput and blade life.

 

Key Features:

Dicing Blades for Wafer & Package Singulation

Wide range of grit sizes
Variable bond hardness
Choose from three different diamond concentrations

Kulicke and Soffa Bonding Equipment
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K&S are the world leading manufacturer of manual and semi-automatic bench mounted wire bonders, fully automatic gold wire bonders and copper stud bump bonding systems as well as automatic die bonding systems.

FURTHER INFORMATION & REQUEST FORM:

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Dicing Semiconductor Wafers and Cutting Hard Materials, Cutting Precision Metal Parts, Dicing Thin Film Substrates, Wire Bonding Gold Wire, Ball Bonding Copper Wire, Flip Chip Bump Bonding, Stud Bumps

Industry Segments

Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonics Components, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices

Kulicke & Soffa Website

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Available from Inseto in the United Kingdom, Ireland & Nordic Region

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Telephone:
+44 (0)1264 334505

Email:
enquiries@inseto.co.uk

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