MPP is a world leading manufacturer of advanced wire bonding tools, incorporating the former Kulicke and Soffa Microswiss technology, including ultrasonic wedge tools for small wire and ribbon bonding, die attach collets and die bond tools, with customs tools also available on request.
The MPP product range is designed to suit all major brands of wire bonding, die bonding equipment, including K&S, Orthodyne, ESEC, ASM, Delvotec, Hesse (formerly Hesse & Knipps), TPT, Hybond, Westbond etc. Please contact us with your specific requirements.
Product range overview
MPP manufactures a complete line of standard and custom wedge tools to fit all applications, including fine pitch bonding for all types of bonding platforms. Their wedge tools are selected or specially designed to meet customers' specifications for bond length, shape, surface finish, front & back radius and other criteria affecting bond location, strength and looping.
FURTHER INFORMATION & REQUEST FORM:
Tel: +44 (0)1264 334505
Wedge Wire Bonding, Ribbon Bonding, Die Bonding, Tab Bonding, Eutectic Die Attach, Die Sorting
Semiconductor Production, Microelectronic Assembly, Power Semiconductor Assembly, Semiconductor Back-end Assembly, University Research etc.
Available from Inseto in the United Kingdom, Ireland & Nordic Region