Spectrum-LCC Packages
Spectrum-TO Headers
Spectrum-Ceramic Packages and Lids

GLASS / CERAMIC PACKAGES & LIDS FROM SPECTRUM SEMICONDUCTOR MATERIALS

Spectrum Semiconductor Materials is the largest independent stocking distributor for metal, ceramic and plastic semiconductor packages and lids. Since 1990 they have been providing customers around the world with timely delivery of competitively priced microelectronic packaging materials. Their goal is to provide you with the optimal products for your engineering, testing and production requirements. An extensive inventory of hundreds of thousands of products ready to ship to you from their headquarters in San Jose, California, including:

  • Power Transistor Outline (TO) Packages
  • Hybrid Packages - Ceramic and Metal
  • Ceramic Pin Grid Array Packages (CPGA)
  • Ceramic Quad Flat Pack (CQFP)
  • Ceramic Small Outline Packages (CSOP)
  • Flat Packs
  • Ceramic Small Outline Packages (CSOP)
  • Cerquads - EIJA and JEDEC
  • Cerpacs
  • CERDIPs
  • J Lead Chip Carriers Ceramic
  • Leadless Chip Carriers (LCC)
  • Side Braze Packages
  • Microwave Transistor (Micro-T) Packages
  • Plastic Equivalent Packages
  • Plastic Pin Grid Array Packages (PPGA)
  • Lids for above packages etc

FURTHER INFORMATION & REQUEST FORM:

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

High Reliability Hermetic Glass And Ceramic Sealed Assemblies, High Reliability Glass Sealed Feed-Throughs, Ceramic Feed-Throughs, Microwave Assemblies, Detonator Fuses, Vacuum Seals, Optical Component Headers, Hermetic Switch Components, High Pressure Connectors, Military & Civil Aviation Connectors, Custom Sight Glass Windows, Die Bonding Sub-Mounts, Heat Dissipation / Heatsinks, Thermal Interface, Microwave Carriers, LDMOS, Power and Bi-Polar RF Transistor Packages, Laser Diode Substrates, Mounts and Blocks, RF Transistor Flanges and Bases, Seal Frames, Hermetic Packages & Enclosures, High Speed Digital Packages

Industry Segments

Microelectronic / Hybrid Assembly Industries, Semiconductor Assembly / Back-end Assembly etc., Fibre Optics / Photonic Assembly, Microwave Electronics, Military & Civil Aviation, Telecommunications, Satellite / Space Electronics, Oil Exploration & Production, Wireless Internet Infrastructure, Aerospace, Industrial, Power Semiconductor Assembly etc.

Region

Available from Inseto throught Europe.

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Message

Telephone:
+44 (0)1264 334505

Email:
enquiries@inseto.co.uk

ISO 9001 Certificate No. 12416