Silica Wafers

GLASS AND FUSED QUARTZ WAFERS:

  • Borosilicate or Alumino Silicate Glass & Fused Silica Wafers
  • Available in 2" to 200mm Diameters or Rectangular Sizes
  • Double Side Polished, Thickness ≥200 µm
  • Custom Coatings, Processing and Dicing
  • Supply and Shipment Worldwide from Stock

Inseto supplies and stocks an extensive range of glass and fused silica wafers including Borosilicate glass, alumino silicate glass and fused silica. We offer a full dicing service on these wafers also with no minimum order quantity and a very rapid 5 day turnaround on delivery.


• Glass and fused silica wafers from 2” to 200mm dia from stock
• Polished to 20/10 MIL standard for the smoothest surfaces

• Edge rounded for safe secure handling

• Pre-cleaned wafers available
• No minimum order quantities
• Wafer dicing available to any die size

Please do not hesitate to contact our support team for application and technical advice, if you need assistance specifying your wafers.

Product range overview

 

Coated Semiconductor Wafer Processing

Typical Glass Wafers:

• Diameter: 2" (50.8 mm), 3" (76.2 mm), 100 mm, 125 mm, 150 mm, 200 mm, plus Square formats

Material: Borofloat, Fused Silica, Quartzglass, BK7, Eagle XG, Soda Lime, B270

Thickness: ≥200 µm

Surface Finish: Double Side Polished

Surface Quality (S/D): From 20/10 to 80/50

Surface Roughness: Ra 6-12 Å

FURTHER INFORMATION & REQUEST FORM:

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Graphene, Power Electronics, Medical Devices, CMOS, Microfluidics, MEMS Devices, Sensors, Renewable, Energy Harvesting etc.

Industry Segments

Semiconductor & Related Research and Manufacturing, Coating Development, Adhesion Testing etc.

Region

Available Worldwide from Inseto

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Telephone:
+44 (0)1264 334505

Email:
enquiries@inseto.co.uk

ISO 9001 Certificate No. 12416