Inseto supplies and stocks an extensive range of glass and fused silica wafers including Borosilicate glass, alumino silicate glass and fused silica. We offer a full dicing service on these wafers also with no minimum order quantity and a very rapid 5 day turnaround on delivery.
• Glass and fused silica wafers from 2” to 200mm dia from stock
• Polished to 20/10 MIL standard for the smoothest surfaces
• Edge rounded for safe secure handling
• Pre-cleaned wafers available
• No minimum order quantities
• Wafer dicing available to any die size
Please do not hesitate to contact our support team for application and technical advice, if you need assistance specifying your wafers.
Product range overview
Typical Glass Wafers:
• Diameter: 2" (50.8 mm), 3" (76.2 mm), 100 mm, 125 mm, 150 mm, 200 mm, plus Square formats
• Thickness: ≥200 µm
• Surface Finish: Double Side Polished
• Surface Quality (S/D): From 20/10 to 80/50
• Surface Roughness: Ra 6-12 Å
FURTHER INFORMATION & REQUEST FORM:
Tel: +44 (0)1264 334505
Graphene, Power Electronics, Medical Devices, CMOS, Microfluidics, MEMS Devices, Sensors, Renewable, Energy Harvesting etc.
Semiconductor & Related Research and Manufacturing, Coating Development, Adhesion Testing etc.
Available Worldwide from Inseto