Inseto
Inseto

Knowledge Base Fact Sheet

MPP & KnS Adjusting Bond Force Settings (IKB-009)

Bond Force Settings: Adjustment of the process bond force parameters for 1st and 2nd Bonds on Micro Point Pro (KnS) 4500 Series and 5000 iBond Series Manual Wire Bonders.
  • During the bonding cycle, bond force is applied while ultrasonic energy is been applied to the wedge/capillary. The static bond force is a combination of the Static Bond force and also additional bond force applied from the Force coil.

45xx Series:

  • The Force coil is controlled via the 1st Bond and 2nd Bond potentiometer dials on the left hand side front panel:

K&S or MPP 4500 Series Force Parameter Adjustments

iBond5000 Series:

  • The Force coil is controlled via 1st and 2nd Bond Force adjustment on the touch screen panel:
MPP iBond 5000 Series Force Parameter Adjustments

To Set the Bond Force:

  • Ensure the Bonder is in Reset Position; confirm this by ensuring the ‘1st Bond LED’ is illuminated (4500 series) or ‘Reset Position’ is displayed in the status window (iBond series).
  • The ‘Set Up/Reset’ switch located on the right hand side panel (4500 series) or ‘Setup’ slider within the iBond5000 menu section (iBond series) are showing SETUP.
  • With the bonder in SETUP the machine will drive the Force Coil constantly at both 1st and 2nd bond forces depending on the machine cycle position.
Setting the Bond Force on K&S or MPP Manual Wire Bonders

  • Set both 1st and 2nd Search adjustment to zero.
  • Press and hold the ‘Semi/Auto Chessman button’. The bond head will move into the ‘1st Search height’.
  • Using a suitably scaled gram gauge lift the bond head under the wedge/capillary. As the bond head starts to rise, read the value on the gram gauge.
  • This measured value is the bond force for the 1st Bond; adjust the ‘1st Bond Force adjustment’ until a desired force is measured on the gram gauge.
  • Release the ‘Semi/Auto Chessman button’, the bond head will move to the ‘Loop Height’.
  • Press and hold the ‘Semi/Auto Chessman button’. The bond head will move into the ‘2st Search height’. Again lift thebond head with the gram gauge under the wedge/capillary until the bond head starts to rise.
  • This measured value is the bond force for the 2nd Bond; adjust the ‘2nd Bond Force adjustment’ until a desired force is measured on the gram gauge.
  • Release the ‘Semi/Auto Chessman button’, the bond head will move to the ‘Reset Height’.
  • Return the ‘Set Up/Reset’ switch to the mid position.
Measuring the Bond Force on K&S or MPP 4500 Manual Wire Bonders

For further information on our range of MPP Manual Wire Bonders, please click HERE.

Author

Date

Version

Author

Adam Marshall

Date

02 June 2017

Version

IKB009 Rev. 3

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