Knowledge Base Fact Sheet
MPP Bonding Wedge Tool Nomenclature
Bonding Wedge Tool Nomenclature: This article explains the nomenclature used to identify Micro Point Pro’s bonding tools for wire and ribbon bonding (IKB-010).
Bonding wedge tool selection is key to a successful and stable wire bond process. Bonding tools are high precision manufactured, with attributes specific to the wire diameter in use and bonding process parameters.
Bonding wedge tools are manufactured from three main materials:
- Tungsten Carbide for aluminium wire
- Titanium Carbide for gold wire
- Ceramic tipped tungsten carbide tools are also available for gold processes
The figure below describes the Micro Point Pro round wedge nomenclature:
Three main selection criteria for the above bond wedges are:
Hole Diameter (H):
This contributes to bond placement accuracy and wire clearance during looping.
Hole Angle (Ha):
This contributes to looping consistency, heel stress in the bonds and tailing consistency.
Bond Length (BL):
Directly affects 1st / 2nd bond size, wire pull strength.
For further information on our range of Bonding Wedge Tools, please click HERE.
For further information on our range of Wirebonding Materials, please click HERE.
For further information on our range of MPP Manual Wire Bonders, please click HERE.
For further information on our range of Kulicke and Soffa Automatic Wedge Bonders, please click HERE.
11 August 2017
IKB010 Rev. 1