Date
May 2021
Description
Two new automatic ball bonders with manual handling deliver high levels of repeatability, provided through real-time monitoring and advanced process diagnostics at Filtronic.
Link
News & Events
Further information about our Company, website and events including:
News – View all of our current news announcements.
Newsletters – Download copies of our “Connect” Company Newsletters.
Press Releases – View copies of all our latest press releases.
Exhibitions & Events – See below a list of all relevant exhibitions & events we are attending this year.
Latest News
Date
Description
Date
April 2021
Description
Ultrasonic Battery Bonding – That’s the essence of the cover story of this month’s issue of Electronic Product Design & Test, for which Inseto was one of the expert companies interviewed and quoted.
Link
Date
March 2021
Description
DELO introduce a new range of SVHC-free MONOPOX adhesives for dam and fill, gloptop and similar applications.
Link
Date
March 2021
Description
Large wire bonder for wire or ribbon bonding of batteries and wide bandgap semiconductor devices (SiC & GaN), installed by Inseto at Custom Interconnect’s new UK, BEV facility.
Link
Date
February 2021
Description
Tresky AG release a new manual die bonder T-4909-AE (Anniversary Edition).
Link
Date
November 2020
Description
Prosepctor installed for advanced bond and micro-material testing of power electronic and other microelectronic devices.
Link
Exhibitions
Date
Description
Date
22 – 25 February, 2021
Description
innoLAE 2021 (Online)
Link
Date
25 March, 2021
Description
MicroTech Annual Conference (Online)
Link
Date
13 – 15 July, 2021
Description
CPE2021 – Centre for Power Electronics Annual Conference
Link
Date
9 September, 2021
Description
FAST Exhibition – British Motor Museum
Link
Date
13 – 16 September, 2021
Description
EMPC2021 Conference – Gothenburg, Sweden
Link
Date
12 October, 2021
Description
Battery Tech Expo – Silverstone
Link
Date
29 – 30 June, 2022
Description
Battery Cells & Systems Expo (co-located with Advanced Materials), NEC, Birmingham
Link
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