Inseto has been implementing its
business continuity plan this week, in accordance with UK Government and NHS
guidelines regarding COVID-19.
We would like to reassure our
customers, partners and suppliers, that we are continuing with business
operations as normal but have adjusted our processes and practices to best protect
our employees and associates during these exceptional times.
Our Andover head office will
remain open in order to ensure continuity in our administrative and logistics
operations but with reduced staffing levels until at least the 4 May 2020, to
allow for isolation between those present.
During this time, other functions
will be performed remotely including accounting, sales and service operations, with
those staff all working from home. Whilst we will be unable to visit customer
locations or other sites during this time, our remote working processes are
already well established and we are committed to providing the same high
standards of customer care you are accustomed to.
Inseto’s employees can be
contacted as usual during business hours, with telephone, video conferencing and
remote support facilities also available. Please do not hesitate to contact us
for further clarification or information should you require it.
Besides your personal contacts,
please utilise the following email addresses:
DELO MONOPOX TC2270, a new specialist adhesive ideal for chip bonding – and other applications where electrically insulated heat transfer is required – is now available from Inseto.
Andover, United Kingdom – Inseto, a leading technical distributor of equipment and materials, is now supplying DELO’s new MONOPOX TC2270, a thermally conductive, electrically insulating adhesive, which is ideal for bonding silicon die and other applications where rapid heat transfer is essential.
For example, heat build-up is a common reason for
integrated circuit failure and the efficient dissipation of heat in power
semiconductors, as used increasingly in automotive applications, is a
considerable challenge. With a specific thermal conductivity of 1.7 W/mK, DELO
MONOPOX TC2270 ensures efficient heat transfer between die and packaging. It is
also cheaper than silver epoxy, which has the often-unwanted property of being
electrically as well as thermally conductive.
Supplied in 10ml syringes, DELO MONOPOX TC2270
boasts many other benefits too. For instance, the minimum curing temperature is
60oC in about 90 minutes, which means it can be used with temperature
sensitive materials with little risk of introducing stress or causing warpage.
In addition, it is a one-part adhesive, so no mixing is required and storage is
at -18oC, a temperature accommodated by standard commercially
available freezers; whereas most die-attach adhesives need to be stored in
industrial freezers at much lower temperatures, such as -40oC.
Once cured, DELO MONOPOX TC2270 delivers a die
shear strength of 60N/mm2 and has an end-application use range of
-40 to +150oC, which is more than adequate for most silicon-based
Eamonn Redmond, Sales Manager of Inseto,
comments: “The adhesive’s chemistry includes aluminium nitride, which ensures
heat is quickly transferred away from the die, thus increasing the potential
lifetime of the chip. Also, the fact that it is readily available in 10ml
syringes means that users reduce the risk of having to dispose of out-of-date
In addition to its good shear strength, DELO
MONOPOX TC2270 boasts a relatively high flexibility (11% compared to the less
than 2% exhibited by most epoxies), making it ideal for bonding larger die. It
also has a very low water absorption figure of just 0.1% and, once cured, volume resistivity is greater
than 1xE14 Ohm cm and its surface resistance is greater than 1xE13 Ohms.
DELO MONOPOX TC2270 has an anticipated shelf life of six months. The datasheet for this adhesive, along with others from the DELO MONOPOX one-part, heat-cured epoxies range, can be viewedonline at Inseto’s website, which also contains the datasheets of other adhesive types (chemistries, curing methods etc.) and an extensive Knowledge Base library of articles and guidance notes.
Redmond concludes: “The TC2270 is an extremely useful adhesive in the world of microelectronics and in any application where heat must be transferred without establishing an electrical connection.” Inseto is DELO Industrial Adhesives’ exclusive distributor in the UK and Ireland. Other products available through Inseto include an extensive range of UV cured or light activated epoxies, light cured acrylates, light / heat cured epoxies, dual curing materials, light / anaerobic curing adhesives, 2-part polyurethanes, 1- & 2-part epoxies, cyanoacrylates and single part silicones.
With some 90 visitors attending from industry and academia, the inaugural SUSS MicroTec sponsored “UK Lithography Conference”, held on 4th July 2019, had an over-arching theme of ‘productivity and efficiency’ and was a resounding success.
Rutherford Appleton Laboratory, the conference was split into three sessions, the
first of which was entitled ‘Surface Preparation’, which began with sound advice
on substrate selection. For this, Ian Burnett of Inseto, had a clear message: quality
lithography depends heavily on quality wafers. Though SEMI standards exist for
wafer thickness tolerances, flatness, surface roughness etc. for repeat runs,
and to ensure consistent results, there is no substitute for using wafers from
the same ingot, supplied in the order in which they were sliced.
Next in the
session, Joost Driven and Dominique Bouwes of Micronit Mictrotechnologies discussed
material structures, focussing on the benefits of polymer and the associated
challenges of processing it; challenges that include ensuring a crack-free
surface, structural accuracy (i.e. dimensions of features), cleanliness (of
channels, trenches and holes) and adhesion. Figure 1 shows how cracks can form.
Bouwes than gave examples of polymer-based devices; a bio chip for life
sciences and a MEMS-based hair flow sensor.
session concluded with Tim Bruchmueller, Product Manager 200mm coaters, of SUSS
MicroTec discussing recent developments with coating technologies in the SUSS
camp. Using the just-launched SUSS ACS 200 GEN3 LabCluster coater and developer
as an example, and without being overly sales-pitchy, Bruchmueller explained
how, for example, developments around the resist bottle (which is inverted)
reduce the risk of getting air into the dispensers.
Also, by taking advantage of the Peltier-Effect (as exhibited by some semiconductors) means positive or negative temperature differentials can be created for heating or cooling purposes. Where cooling is concerned this means no need for compressors (and their associated vibrations) and refrigerant liquids. Perhaps the biggest benefit is a lower electricity bill, as reflected in figure 2.
for this session was Exposure, and Dr. Marc Hennemeyer, Director of SUSS
MicroTec’s Application Centre for Lithography, started proceedings by giving a
presentation on MEMS processing challenges. These include needing consistent
processing for different types of substrate material (Si, SiO2,
LiTa, ceramics etc.) and the popularity of material stacks (for example,
Si-based CMOS device wafers on top of mechanical device wafers).
relatively large features on substrates with high topographies, large exposure
gaps are caused. However, this can lead to reduced side wall angles. Also,
steppers cannot achieve sufficient process results due to their limited depth
of focus (DOF). In this respect, Dr. Hennemeyer proposed Fresnel Zone Plate
(FZP) processing as a solution, describing FZP as, in essence, a diffractive
lens. The process, which is generally for feature sizes greater than 2um, is somewhat
removed from traditional proximity lithography.
A diagram Dr. Hennemeyer talked around is reproduced here as figure 3. It compares the DOF of a traditional mask used to make a hole versus an FZP.
reference to the above diagram, in the top left we have a round hole in a mask.
To the right, we have a prediction of the light intensity when projected
through the mask. The DOF is relatively close to the mask. Below that, on the
left, we have an FZP mask. The pattern is larger and more complex, requiring
polarity changes in the rings, but the DOF is greater (and further away from
Dr. Hennemeyer held the floor to give a follow-on presentation about improving proximity imaging quality using diffractive elements. A key point made concerned the use of optical proximity correction (OPC) and the inclusion of features on the source mask that are not meant to be printed. Rather they are present to ‘influence’ the shape that will be printed. For example, the rounding effect means that a square in the mask might produce something closer to a circle. However, the presence of features (smaller squares) to ‘re-enforce’ the corners can result in the printing of a much better square; subject to the size of the smaller squares and their distance from the main square on the mask. See figure 4.
on mask aligners is more challenging than on steppers. Simulation provides
considerable benefits though according to Dr. Hennemeyer, who went on to
recount the developments of a joint SUSS/GenISys project. Findings to date
reveal that light source stability and reliable gap settings are key to
implementing OPC, which helps in the creation of ‘sharper’ features and steep
SUSS MicroTec kept the floor for the next presentation, as Christof Kronseder gave an overview of UV LED light sources and recounted a number of developments that have taken place during recent years. The advantages of LED over traditional mercury lamps include lower running costs (during use and by virtue of not requiring a warm-up) and reduced cooling requirements. Kronseder recounted that SUSS began its LED journey with an alternative for 350W mercury lamps and is currently working on a 1kW system.
This session was themed ‘Imprint / Applications’ and began with a presentation from Dr. Simon Drieschner, an Applications Engineer with SUSS MicroTec, on solutions for micro and nano imprinting, using substrate conformal imprint lithography (SCIL) and SUSS’s proprietary SUSS MicroTec imprint lithography equipment (SMILE) respectively (see figure 5).
The presentation included a comparison of stamp materials from a total-cost-of-ownership perspective and factored in curing times, which are often overlooked but essential for volume manufacturing scenarios as they can vary from circa 15 minutes to more than three days. Two main materials were compared, epoxides (which are proven in the field) and hybrid acrylates (which are a relatively new development but watch this space as the benefits are considerable). See figure 6.
concluded with a report from academia, in the form of a presentation from
Swansea University, given by Dominic Chung Man Fung and which provided an
example of the SCIL process as part of an Innovate UK funded project.
was to develop a low cost, volume fabrication process for a wafer scale
distributed feedback (DFB) laser. Challenges included feature size and shape
(plus achieving steep sidewall angles), stamp [soft master] curing time, the
hard master having an anti-stick layer (ASL) and, of course, attaining high
results have been achieved so far on 3” wafers. For instance, an ASL for the
hard master has been created using FDTS (a.k.a. Perfluorodecyltrichlorosilane –
an anti-sticking process used in other technology fields) and soft stamps are
exhibiting high reproducibility. The most impressive achievement however is how
rapidly high yield has been attained – see figure 7.
Future goals include attaining 100% yield (far from unachievable considering the results to date), scaling to 4”, 6” and 8” wafers and performing studies into the lifetime of the soft master.
inaugural UK Lithography Conference concluded with a note of thanks from Matt
Brown of Inseto, the organiser of the event. Thanks went to Rutherford Appleton
Laboratory for hosting the conference, to SUSS MicroTec for their sponsorship
and to the speakers (most of whom had travelled in from outside the UK).
To repeat a
few words from the intro of this report, the event was a resounding
success. The lithography community is facing (and as the conference proved, is
solving) a whole host of technical challenges amidst a backdrop of commercial
Productivity and efficiency are being realised through developments in tools and methodologies and, through networking events like the conference, ideas are being shared and further developed – which is all great news for this exciting industry.