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Knowledge Base Fact Sheet

Understanding Wire Pull Testing (IKB-003)

Explanation of non-destructive and destructive testing of ultrasonically welded interconnects in microelectronics.

  • Wire Pull testing is an established methodology for verifying ultrasonic wire bonding interconnects in microelectronics.
  • Pull testing involves a precision tooltip applying an upward (pulling) load on the wire under test, while workpiece or product assembly is held stationary.
  • As the tool moves upwards, the force (load) being applied to the work sample is accurately measured and recorded as the test result.
  • Standard wire pull test involves a suitable pull hook being placed underneath the wire loop being tested.
  • Load applied perpendicular (at 90°) to the workpiece under test.
  • Destructive testing tests ultimate strength of the wire bonding until failure occurs.
  • Non – destructive testing applies a pre-defined load to the wire under test for a pre-defined duration to test wire integrity on high value assemblies without compromising the interconnect itself.
  • Pull test can be used for ball bond, wedge bond and ribbon bond interconnects.
Wire bond pull test method and failure modes.

For more information on Nordson-DAGE bond and materials testing equipment, please click HERE.

Author

Date

Version

Author

Jim Rhodes

Date

22 May 2017

Version

IKB003 Rev. 3

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