Knowledge Base Fact Sheet
Understanding Wire Pull Testing
Explanation of non-destructive and destructive testing of ultrasonically welded interconnects in microelectronics (IKB-003).
- Wire Pull testing is an established methodology for verifying ultrasonic wire bonding interconnects in microelectronics.
- Pull testing involves a precision tooltip applying an upward (pulling) load on the wire under test, while work-piece or product assembly is held stationary.
- As the tool moves upwards, the force (load) being applied to the work sample is accurately measured and recorded as the test result.
- Standard wire pull test involves a suitable pull hook being placed underneath the wire loop being tested.
- Load applied perpendicular (at 90°) to the work-piece under test.
- Destructive testing tests ultimate strength of the wire bonding until failure occurs.
- Non – destructive testing applies a pre-defined load to the wire under test for a pre-defined duration to test wire integrity on high value assemblies without compromising the interconnect itself.
- Pull test can be used for ball bond, wedge bond and ribbon bond interconnects.
Wire Pull Test Method, please click HERE.
Nordson-DAGE bond and materials testing equipment, please click HERE.
22 May 2017
IKB003 Rev. 3